Editorial Team - PCB Directory
Aug 30, 2024
Rogers PCB materials are high-performance PCB substrate materials made by Rogers Corporation that offer superior performance and temperature characteristics compared to other commonly used materials like FR-4. Where FR-4 is typically made up of woven fiberglass cloth with an epoxy resin binder, Rogers materials use ceramic instead of epoxy resin as the base. This gives Rogers materials a lower dielectric constant for the ability to perform well at high frequencies and better temperature stability compared to FR-4. They are suitable for high-speed, commercial microwave and RF applications.
Key Characteristics
Some of the key features of Rogers PCB materials include:
Rogers PCB materials also have a minimal water absorption property which makes them suitable for use in high-humidity applications. The use of highly reliable ceramic materials for their fabrication increases the cost compared to standard FR-4 materials. But compared to other high-frequency substrate materials which usually require special manufacturing processes, Rogers materials can be processed similarly to FR-4.
Specifications
Property
Typical Values
Thermal Conductivity
0.6 to 1.6 W/mK in the Z-axis
Glass Transition Temperature (Tg)
Greater than 280°C
Decomposition Temperature (Td)
Up to 350°C
Coefficient of Thermal Expansion (CTE)
10 to 20 ppm/°C
Low Loss Tangent
0.0014 to 0.003 at 10 GHz
Dielectric Constant (Dk)
2.5 to 10.2
Applications of Rogers Materials
Rogers PCB materials’ ability to operate at high frequencies and stable dielectric constants with low signal losses is ideal for RF, microwave, and millimeter-wave applications. They are preferred for use in RF PCBs with operating frequencies of over 6 GHz. Hence, they are used to make advanced electronics of networking equipment in wireless, satellites, and phased-array radar systems. These materials can maintain signal integrity, have low moisture absorption and avoid PCB deformation at high temperatures making them suitable for automotive, aerospace and defense electronics. They also have high design flexibility and can be processed with standard fabrication processes while meeting industry certification requirements.
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