Editorial Team - PCB Directory
Sep 16, 2024
PCB Reverse Engineering (RE) is the systematic process of analyzing an already existing printed circuit board to be able to recreate its design for a functional equivalent. This process breaks down a PCB into its core components, which are then used to extract schematic diagrams, reconstruct the PCB layout, and generate a bill of materials. The basic objective is to understand the board's design and functionality, which allows engineers to build identical or improved versions of the PCB, especially when no original documentation of the board is available.
PCB Reverse Engineering involves focused research, reverse analysis, and reproduction of PCB design diagrams to document the structural and functional characteristics of a PCB. It allows engineers to recreate old PCB boards whose schematic diagrams have been lost over time. These boards can also be then modified or improved according to requirements. Identifying the inaccessible design particulars in a board also allows companies to innovate and gain a competitive edge as they can reverse engineer components of competitors' products and make their designs better at a lower cost.
Types of PCB Reverse Engineering:
Destructive RE: This process involves imaging and subsequent removal of all layers of the board using various milling techniques or tools. Imaging can be done using any regular camera or advanced purpose-built RE systems that utilize calibrated image sources for extremely accurate reproduction of the design data for the board. This type of RE process destroys the PCB and would require even more care if the data comes from the last remaining circuit card in existence. If areas of copper on a board are removed before they are imaged it will result in a permanent loss of data.
Non-Destructive RE: In this process, the circuit board itself is not destroyed; however, most non-destructive techniques require removing components from the surface of the board. The primary difference between destructive and non-destructive methods is in the way that images for the board are captured before new data is generated - the internal layers of the board are imaged using X-ray imaging technologies like X-ray Computed Tomography (CT) scanning which does not require the board to be taken apart. The captured optical images of the top and bottom of the board are then merged with these X-ray images of the board's internal layers.
PCB Reverse Engineering Process
The reverse engineering of PCB is a methodical process that goes through every detail of the board. In general, it includes the following steps:
Advantages of Reverse Engineering PCBs
Reverse engineering PCBs offer numerous benefits, including the preservation of critical components by enabling repairs or replacements for obsolete boards, even when parts or documentation are unavailable. It allows for information retrieval in cases where schematics or design details are missing, ensuring boards can be replicated or repaired. This process also reduces dependence on external experts by providing in-house teams with detailed knowledge of the PCB’s design and function, facilitating easier troubleshooting and repairs. Additionally, reverse engineering provides a competitive advantage by identifying flaws or cost-saving opportunities in competitors' designs, leading to the development of more efficient or cost-effective alternatives, ultimately resulting in significant cost reductions.
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