What is peelable solder mask? When is it used? WHat are its advantages and disadvantages?
Editorial Team - PCB Directory
Feb 15, 2022
A Peelable solder mask is a type of solder mask that can be peeled off the surface of a printed circuit board. This type of solder mask is used to protect specific areas of a PCB during reflow soldering, wave soldering, or surface finish process. It is applied over the pads or plated through holes prior to the PCB assembly process and prevents the accumulation of excess solder on empty pads during the soldering process. It also protects gold plated contacts which can dissolve in molten solder. Peelable solder mask is easier to remove than regular solder masks.
Peelable solder masks are also used in selective surface finish processes such as soft gold PCB surface finish or Hard gold PCB surface finish. This type of solder mask ensures that the correct finish is only applied to the desired areas of the PCB. The surface finish is a coating on the bare copper area of the PCB to provide a solderable surface and to protect the exposed copper circuitry.
A peelable solder mask is also necessary for the parts that will be manually installed after the automated assembly process.
Peelable solder masks are usually applied by screen-printing and are removed after processing at the contracted PCB assembly house. The PCB fabricator can apply the mask in any design or shape on one or several sections per side at a time.
Create an account on PCB Directory to get a range of benefits.
Login to PCB Directory to download datasheets, white papers and more content.
By creating an account with us you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
OR
Our Newsletters keep you up to date with the PCB Industry
Our Newsletters keep up to date with the PCB Update
By signing up for our newsletter you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
Note: File Size should be less than 10MB.