What is Thermal Aging Testing?

PCB Basics 
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Editorial Team - PCB Directory

Jan 15, 2020

Thermal Aging Testing is performed to determine the operational life of the PCB board. It tests the capability of PCB components to withstand extreme temperatures for an extended period of time.

The reliability of components placed on a printed circuit board decreases exponentially with time. This eventually results in the failure of the PCB due to differences in coefficients of thermal expansion (CTE) across the PCB material.

Usually, thermal aging testing is performed in a chamber that stimulates high temperatures and analyzes the PCB components. This chamber accelerates the aging process of the components by putting them under extreme temperature situations.

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