AUO 3000E

AUO 3000E

Depaneling Equipment by Hetsub Technology Co., Ltd (12 more products)

Note: Your request will be directed to Hetsub Technology Co., Ltd

Product Specifications

Product Details

  • Part Number
    AUO 3000E
  • Manufacturer
    Hetsub Technology Co., Ltd

General Parameters

  • Depaneling Mode
    Motorized
  • PCB Thickness
    0.5 to 2.0 mm
  • Separating Speed
    100 mm/sec
  • Working Area
    330 x 330 x 60 mm
  • Max Component Height
    Top - 15 mm, Bottom - 35 mm
  • Air Pressure
    5 bar
  • Power Supply
    3-phase AC 220 V ± 3% 50 Hz / 60 Hz, 2.5 kw
  • Net Weight
    390 kg
  • Overall Dimensions
    1168 x 1480 x 1256 mm

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