CuttingMaster 2000 Ci

CuttingMaster 2000 Ci

Depaneling Equipment by LPKF Laser & Electronics AG (8 more products)

Note: Your request will be directed to LPKF Laser & Electronics AG

Product Specifications

Product Details

  • Part Number
    CuttingMaster 2000 Ci
  • Manufacturer
    LPKF Laser & Electronics AG

General Parameters

  • Depaneling Mode
    Motorized
  • PCB Materials
    FR-4
  • Working Area
    350 x 250 mm
  • Net Weight
    450 kg
  • Overall Dimensions
    875 x 1510 x 1125 mm

Technical Documents

View more details on the manufacturer's website
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