MCL-E-705G

Note: Your request will be directed to Resonac Corporation

MCL-E-705G

The MCL-E-705G from Resonac Corporation is a PCB Laminates with Tg 295 to 305 Degree C. More details for MCL-E-705G can be seen below.

Product Specifications

Product Details

  • Part Number
    MCL-E-705G
  • Manufacturer
    Resonac Corporation

General Parameters

  • Type
    High Temp, Halogen-free, HDI
  • Tg
    295 to 305 Degree C
  • Halogen Free
    Yes
  • Applications
    Semiconductor packages. (FC-BGA, FC-CSP, PoP, SiP), HDI, PWB, Thinner module PWB
  • Cte xy
    5 to 7 ppm/Degree C
  • Cte z
    10 to 15 ppm/Degree C, 70 to 100 ppm/Degree C
  • Peel strength
    0.8 to 1 kN/m, 0.9 to 1.1 kN/m
  • Size
    35 x 35 mm
  • Surface resistivity
    1 x 1013 to 1 x 1015 ohms
  • Thickness mm
    0.4 mm
  • Volume resistivity
    1 x 1014 to 1 x 1016 ohms-cm
  • Note :
    Decomposition Temp - 430 to 450 Degree C, Flexural Modulus - 32 to 34 Gpa

Technical Documents

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