SE3000

SE3000

Solder Paste Inspection Equipment by CyberOptics Corporation (9 more products)

Note: Your request will be directed to CyberOptics Corporation

The SE3000 from CyberOptics is a 3D Solder Paste Inspection System that supports PCBs from 50 x 50 mm to 510 x 510 mm. It incorporates CyberOptics&rsquo MRS sensor technology with 4 multi-view 3D sensors and a parallel projector that simultaneously captures and transmits multiple images in parallel while proprietary 3D fusing algorithms merge the images together, delivering metrology grade accuracy at production speed. The Dual-Mode MRS Sensor for SPI provides the flexibility to use one mode for high-speed inspection and another mode for high resolution inspection with one sensor. It has an inspection resolution of up to 9 &mum (in high resolution mode) and a maximum inspection speed of 46 cm2/sec.

The SE3000 uses CyberOptics&rsquo SPI software that delivers a world-class user experience with its intuitive interface that is extremely stable and simple to use. With a full multi-touch experience, SPI software offers a range of features that enable smarter and faster inspection. It is available in an enclosure that measures 110 x 127 x 139 cm with SMEMA, RS232 and Ethernet interfaces for connectivity. This system is ideal for measuring height, area, volume, registration and bridging. It effectively detects insufficient paste, insufficient height, insufficient area, excessive paste, excessive height, smear, offset, shape height, deposit and customer defect types. The SPI system requires an AC supply of 100-120/220-240 V and consumes less than 15 A of current.

Product Specifications

Product Details

  • Part Number
    SE3000
  • Manufacturer
    CyberOptics Corporation
  • Description
    510 x 510 mm 3D Solder Paste Inspection System

General Parameters

  • Field of View
    36 x 36 mm(MRS Sensor), 21 x 21 mm(Ultra High Resolution MRS Sensor)
  • PCB Size
    50 x 50 mm(MRS Sensor), 510 x 510 mm(Ultra High Resolution MRS Sensor)
  • PCB Thickness
    0.3 to 5 mm
  • PCB Weight
    3 kg
  • Imaging Resolution
    18 µm(MRS Sensor), 9 µm(Ultra High Resolution MRS Sensor)
  • Imaging Speed
    Peak: 35 cm2 /sec (2D+3D)(MRS Sensor), Peak: 15 cm2/sec (2D+3D)(Ultra High Resolution MRS Sensor), Average: 30 cm2/sec (2D+3D)(MRS Sensor), Average: 12 cm2/sec (2D+3D)(Ultra High Resolution MRS Sensor)
  • Top Clearance
    30 mm
  • Bottom Clearance
    35 mm
  • Edge Clearance
    Top: 2.5 mm (0.10 in.) Bottom: 3.0 mm
  • Net Weight
    2127 lbs
  • Overall Dimensions
    110 x 127 x 139 cm

Technical Documents

View more details on the manufacturer's website
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