PI PICO M

PI PICO M

Solder Paste Inspection Equipment by Vi TECHNOLOGY (5 more products)

Note: Your request will be directed to Vi TECHNOLOGY

Product Specifications

Product Details

  • Part Number
    PI PICO M
  • Manufacturer
    Vi TECHNOLOGY

General Parameters

  • Field of View
    160 mm x 55 mm
  • Defects
    Bridge, Insufficient Paste, Shape 2D, Shape 3D, User Defined Defects, Excessive Paste, Missing paste
  • Measurement
    Height, Area, Volume, Offset, Bridging, Shape 2D, Shape 3D, Coplanarity
  • PCB Size
    533 x 533 mm (21 x 21 inch)
  • PCB Thickness
    0.1 mm to 5.0 mm
  • PCB Weight
    4 kg
  • Imaging Resolution
    15 µm
  • Height Resolution
    100 nm
  • Camera
    80 Mpixel, 12-bit CMOS sensor
  • Top Clearance
    20 mm
  • Bottom Clearance
    50 mm
  • Edge Clearance
    3 mm
  • Conveyor Height
    830 to 930 mm
  • Max. Solder Height
    400 µm
  • Lighting
    White LED + RGB lighting
  • Net Weight
    430 kg
  • Overall Dimensions
    1 000 mm (Option 800 mm) x 1 296 mm x 1 647 mm

Technical Documents

View more details on the manufacturer's website
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