Solder Paste Inspection Equipment by Vi TECHNOLOGY (5 more products)

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The PI PRIMO XL from Vi TECHNOLOGY is a 3D Solder Paste Inspection (SPI) Machine that supports PCBs from 50 x 50 mm to 762 x 533 mm. In addition to paste inspection, it also offers simultaneous glue dot inspection. This machine uses PI’s patented Z-referencing technology which provides unprecedented accuracy to paste volume measurement. PI is designed to operate solely with a touch screen icon-based interface with no keyboard and no mouse. Calibration is done at a press of button with embedded geometric and radiometric calibration tools to ensure consistent performance over time, and machine-to-machine portability. It supports auto-programming which enables high quality inspection independently of programmer’s skill level. With auto-programming, fine tuning is no longer required, and performance is consistent.

The PI PRIMO XL is available in an enclosure that measures 1000 x 1296 x 1647 mm and requires an AC supply.

Product Specifications

Product Details

  • Part Number
  • Manufacturer
  • Description
    3D Solder Paste Inspection (SPI) Machine for PCBs up to 762 x 533 mm

General Parameters

  • Field of View
    350 mm x 55 mm
  • Defects
    Insufficient, Excessive, Missing paste, Bridge, Shape 2D, Shape 3D, user defined defects
  • Measurement
    Height, Area, Volume, Offset, Bridging, Shape 2D, Shape 3D, Coplanarity
  • PCB Size
    762 x 533 mm (30 x 21 inch)
  • PCB Thickness
    0.1 mm to 5.0 mm
  • PCB Weight
    4,5 kg
  • Imaging Resolution
    15 µm
  • Height Resolution
    100 nm
  • Camera
    160 Mpixel, 12-bit CMOS sensor
  • Top Clearance
    20 mm
  • Bottom Clearance
    50 mm
  • Edge Clearance
    3 mm
  • Conveyor Height
    830 to 930 mm
  • Max. Solder Height
    400 µm
  • Lighting
    White LED + RGB lighting
  • Net Weight
    430 kg
  • Overall Dimensions
    1 000 mm (Option 800 mm) x 1 296 mm x 1 647 mm

Technical Documents

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