The S3088 from Viscom is a 3D Solder Paste Inspection System that supports PCB size of 508 x 508 mm. It uses the fringe projection process of measuring and has an inspection speed of 90 cm²/s with a field of view size of 58.2 mm x 58.2 mm. This system has an orthogonal camera resolution of 10 μm and combines four angled views to deliver perfect, shadow-free inspection results. It is based on the unique and proven XM camera technology from Viscom and combines precise defect detection with the highest inspection speed. The SPI system inspects all quality criteria for solder paste deposits, including volume, shape, surface, height, offset, paste bridges and paste smearing. It has an option for Viscom’s FastFlow handling which offers extremely high throughput rates.

Evaluating the 3D measurement data and linking the results via quality uplink with the paste printer, placement system, AOI and AXI allows for effective process control and sustainable quality improvement. It is available in an enclosure that measures 994 x 1565 x 1349 mm and requires an AC supply of 400 V.