S3088 SPI

S3088 SPI

Solder Paste Inspection Equipment by Viscom AG (1 more product)

Note: Your request will be directed to Viscom AG

The S3088 from Viscom is a 3D Solder Paste Inspection System that supports PCB size of 508 x 508 mm. It uses the fringe projection process of measuring and has an inspection speed of 90 cm²/s with a field of view size of 58.2 mm x 58.2 mm. This system has an orthogonal camera resolution of 10 μm and combines four angled views to deliver perfect, shadow-free inspection results. It is based on the unique and proven XM camera technology from Viscom and combines precise defect detection with the highest inspection speed. The SPI system inspects all quality criteria for solder paste deposits, including volume, shape, surface, height, offset, paste bridges and paste smearing. It has an option for Viscom’s FastFlow handling which offers extremely high throughput rates.

Evaluating the 3D measurement data and linking the results via quality uplink with the paste printer, placement system, AOI and AXI allows for effective process control and sustainable quality improvement. It is available in an enclosure that measures 994 x 1565 x 1349 mm and requires an AC supply of 400 V.

Product Specifications

Product Details

  • Part Number
    S3088 SPI
  • Manufacturer
    Viscom AG
  • Description
    508 x 508 mm High Throughput 3D Solder Paste Inspection System

General Parameters

  • Field of View
    15 x 15 mm
  • PCB Size
    508 mm x 508 mm
  • Imaging Speed
    Up to 80 cm²/s
  • Camera
    15 µm
  • Conveyor Height
    850 - 950 mm ± 20 mm
  • Max. Solder Height
    50–500 µm
  • Net Weight
    750 kg
  • Overall Dimensions
    997 mm x 1600 mm x 1540 mm

Technical Documents

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