The H10 from AIM Metals & Alloys LP is a lead-free, RoHS compliant solder paste with a no-clean flux type and a SAC305 alloy. It has a T4 particle size and boasts high transfer efficiency, strong activity, and minimal high SIR residues. It has a shelf life of 6 months when stored between 0°C-12°C (32°F-55°F) and a shelf life of 3 months when stored unrefrigerated below 25°C (<77°F). 

The recommended initial printer settings include a squeegee pressure of 0.5 – 1.0kg/25mm, a squeegee speed of 13 – 152 mm/second. Additionally, a snap-off distance on contact of 0.00 mm, a PCB separation distance of 0.75 - 2.0 mm, and a PCB separation speed of 3 - 20 mm/second are also recommended.

The H10 solder paste has a transfer efficiency of over 90% on area ratios of 0.50, making it highly effective for use in a wide range of applications. Its wetting performance is outstanding, eliminating NWO (HiP) defects and improving pad coverage on all surface finishes. The H10 solder paste also reduces voiding on BGA, BTC, and LGA and improves electrochemical reliability on all low stand-off devices.