WS890

WS890

Solder Paste by FCT Solder (5 more products)

Note: Your request will be directed to FCT Solder

The WS890 from FCT Solder is a Lead-Free, Water-Soluble Solder Paste that can be coupled with solder alloys like SAC305, Sn/Ag 3.5%, SN100C, SN100CV, LF-C2, and anti?tombstoning mixtures. It provides highly reliable solder joints for harsh temperatures when coupled with SN100CV or LF-C2 alloys. This solder paste supports bead sizes of 1.0 to 2.5 cm and a print speed of 20 to 200 mm/s using fine grain laser cut stainless steel stencils. It has a melting range of 205 to 227 °C and has been designed to provide exceptional wetting, very low solder balling,and graping. This solder paste has been formulated for environmental stability with a long stencil life of 8 hours (at 18-29 °C and 30-70% RH) and exceptional reflow & print characteristics. It has a shelf life of 9 months (at 0 to 10 °C) and is available in different types of packaging including 500 g jars, 500-1300 g cartridges, and 30/100 g syringes.

Product Specifications

Product Details

  • Part Number
    WS890
  • Manufacturer
    FCT Solder
  • Description
    Lead-Free, Water-Soluble Solder Paste for Stencil Printing and Reflow Soldering

General Parameters

  • Type
    Lead Free
  • Flux Type
    Water Soluble
  • Alloy
    SAC305, Sn/Ag 3.5%, SN100CV, LF-C2
  • Alloy Composition
    Sn/1.5Bi/0.7Cu/Ni/Ge
  • Particle Size
    Type 3 & 4
  • Melting Point
    217 to 225 Degree C
  • Package Type
    Jar, Cartridge, Syringe
  • Shelf Life
    9 Months
  • Storage Temperature
    0 to 10 °C
  • Net Weight
    30 - 1300 grams

Technical Documents

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