Note: Your request will be directed to Indium Corporation
The Indium8.9HFRV from Indium Corporation is a No-Clean Solder Paste that is formulated for use in electronic assembly applications. It is composed of Indalloy® 292, Indalloy® 276, Indalloy® 133, and Indalloy® 259 Type 4 alloys and has 89.0% metal content providing low-voiding performance and excellent wetting. This solder paste supports bead sizes from 20 to 25 mm in diameter and print speeds of 25 to 150 mm/s for air-reflow soldering processes. It has a melting point range of 260 degrees Celsius and requires a squeegee pressure of 0.018–0.027 kg/mm. This solder paste is Halogen & Lead-free and compatible with IPC J-Standard-004. It is available in 500 g jars or 600 g cartridges.
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