Note: Your request will be directed to MacDermid Alpha Electronics Solutions
The ALPHA ® JP-501 from MacDermid Alpha Electronics Solutions is a No-Clean Solder Paste for JetPrinting. It features a rheology capable of standard dispensing or jetting. The low temperature,lead-free alloy in this solder paste has a melting point of 138 °C, and has been successfully usedwith peak reflow profiles between 155 and 190 °C.The flux residue from it isclear and colorless and is formulated to offer high electrical reliability in a zero-halogen fluxformulation. It has an outstanding reflow process window which delivers good soldering on CuOSP, lead-free HASL, immersion silver, immersion tin and ENIG surface finishes. The ALPHA JP-501 israted ROL0 per IPC J-STD-004.
The ALPHA ® JP-501 reduces energy consumption in reflow ovens versus standard lead-free alloys. It has a low temperature reflow profile which may enable the use of less expensive printed circuit boardsubstrates, when appropriate. This paste is designed for use with the Mycronic Jet Printers and is compatible with Mycronic MY700 jetting equipment.
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