Solder Paste by MacDermid Alpha Electronics Solutions (15 more products)

Note: Your request will be directed to MacDermid Alpha Electronics Solutions

The OM-565 is a zero-halogen low-temperature solder paste designed to reduce defects caused by warpage in chip-scale packages that are temperature sensitive. It allows for minimizing post reflow defects such as Non-Wet-Open (NWO) and Head-in-pillow (HIP) because of the solder paste used. It enables the assembly to reach peak reflow temperatures up to 175°C as well as superior wettability.

The low melting point reflow increases the energy efficiency and reduces the energy costs involved in the assembly process. It even offers compatibility with contact rework applications with 8-hour stencil life in ambient and elevated conditions.

Product Specifications

Product Details

  • Part Number
    ALPHA OM-565 HRL3
  • Manufacturer
    MacDermid Alpha Electronics Solutions
  • Description
    Halogen-Free Low-Temperature Solder Paste

General Parameters

  • Type
    Lead Free
  • Flux Type
  • Particle Size
    Type 4, Type 5
  • Melting Point
    146 Degree C
  • Package Type
    Cartridge, Jar
  • RoHS
  • Storage Temperature
    0 - 10 Degree C
  • Net Weight
    500 gm

Technical Documents

View more details on the manufacturer's website
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