Solder Sphere by MacDermid Alpha Electronics Solutions

Note: Your request will be directed to MacDermid Alpha Electronics Solutions

The ALPHA HRL3 from MacDermid Alpha Electronics Solution are Solder Spheres that are designed for BGA, CSP, and flip chip wafer bumping applications. It uses a proprietary manufacturing process which enables maximum alloy purity, dimensional consistency, and resistance to oxidation and/or darkening. The proprietary manufacturing process ensures low oxide levels in these products which ensure strong, clean and well-formed solder bumps and joints coupled with a suitable flux and process profile. They are available in a wide range of lead-free, tin-lead, high-lead, low-silver, and custom alloys in a variety of common diameters.

Product Specifications

Product Details

  • Part Number
  • Manufacturer
    MacDermid Alpha Electronics Solutions
  • Description
    Solder Spheres for BGA, CSP, and Flip Chip Wafer Bumping

General Parameters

  • Type
    Lead Free
  • Alloy
  • Package Type
  • Diameter
    0.23 to 0.8 mm
  • Tolerance
    ± 0.20
  • Melting Temperature
    138 to 145 Degree C
  • Solidus Melting Temperature
    138 Degree C
  • Liquidus Melting Temperature
    145 Degree C
  • Shelf Life
    1 Year
  • RoHS
  • Net Weight
    1 to 6 oz

Technical Documents

View more details on the manufacturer's website
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