Note: Your request will be directed to Saki Corporation
The 3Xi-M200 V2 from Saki Corporation is an Inline 3D X-ray Inspection System for IGBT power modules. It uses Saki’s unique Planar CT technology to accurately detect thin voids in multi-layer soldering packages. This system achieves high inspection speed through multiple concurrent wide-area imaging processes. It includes a new large detector that reduces the number of FOV images through wide-area imaging and significantly reduces imaging time. This system uses an improved conveyor design that allows the loading of carriers measuring up to 460 x 600 mm. Through batch imaging and inspection of multiple samples, this system reduces cycle time and preparation time, and operator workload is reduced, especially during tray setting.
The 3Xi-M200 V2 features a unique ultra-rigid gantry that results in a long equipment lifetime and high repeatability. It features Saki’s new detector which offers significantly reduced component radiation through the redeveloped lead protection design. This inspection system regularly diagnoses the deterioration of the X-ray source, uneven image brightness, frame distortion, and more. Self-diagnosis prevents sudden equipment failure, reduces equipment downtime, prevents unnecessary replacement of non-defective parts, and reduces maintenance man-hours. It is also equipped with an exposure dose simulator, predicting the exposure dose for each area to optimize imaging conditions.
The 3Xi-M200 V2 has a resolution from 51 to 104 µm and is suitable for PCB sizes from 50 x 140 mm to 460 x 440 mm. This machine is available in an enclosure that measures 1400 x 2165 x 1862 mm and requires an AC supply.
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