The TR7600 SIII Plus from Test Research, Inc. is an X-ray Inspection System that uses 2D, 2.5D, 3D Slicing, and Planar CT (Optional) inspection methods. It uses an X-ray source with an excitation voltage range of 60 to 110 kV and ultra-high-speed line-scan CCD cameras providing a resolution of 2 µm to 20 µm. This equipment is equipped with high-precision ballscrews and AC-servo controllers for X, Y, and Z-axis controls. It can accommodate PCBs of sizes up to 800 x 350 mm and a PCB thickness of 0.6 to 7 mm. It has a high-speed 3D SEMI AXI optimized to meet the throughput demands of OSATs and is Smart Factory ready with MES connectivity.
The TR7600 SIII Plus has the capability to inspect BGAs, back drills, barrel fills, capacitors, resistors, chips, components under RF Shields, WLCSP, DIMM connectors, flip-chips, ground pads, gullwing, heat sinks, j-leads, LED chips, LGAs, paladin connectors, RNET, SiP, SMT connectors, SOIC, SOT, thermal pads, QFNs, QFP, and THTs. It can detect missing components, misalignment, tombstone, billboard, rotation, polarity, insufficient/excess solder, bridging, open connections, solder balls, non-wetting, voids, and lifted lead defects with the use of Smart Programming with AI-powered algorithms like AI-Void Detection and AI Repair Station. This X-ray inspection system requires an AC supply of 200-240 V and consumes 4 kVA of power. It has a footprint of 1470 x 1971 x 1975 mm.
