The TR7600FB SII from Test Research, Inc. is an X-ray Inspection System that uses 2D, 2.5D & 3D Slicing, and Planar CT (Optional) inspection methods. It uses an X-ray source with an excitation voltage range of 40 to 130 kV and Flat panel detector cameras providing a resolution of 5µm to 30µm. This equipment is equipped with high-precision ball screws and AC-servo controllers for X, Y, and Z-axis controls. It can accommodate PCBs of sizes up to 850 x 520 mm and a PCB thickness of 0.4 to 7 mm. This AXI system is Smart Factory ready and integrates with MES and Industry 4.0 environments.
The TR7600FB SII has the capability to inspect BGAs, back drills, barrel fills, capacitors, resistors, chips, components under RF Shields, WLCSP, DIMM connectors, flip-chips, ground pads, gullwing, heat sinks, J-Leads, LED Chips, LGAs, Paladin Connectors, RNET, SiP, SMT connectors, SOIC, SOT, Thermal Pads, QFNs, QFP, and THTs. It can detect missing components, misalignment, tombstone, billboard, rotation, polarity, insufficient/excess solder, bridging, open connections, solder balls, non-wetting, voids, and lifted lead defects with the use of Smart Programming with AI-inspection algorithms like AI-Void Detection and programming. This X-ray inspection system requires an AC supply of 200-240 V and consumes 4 kVA of power. It complies with SMEMA, SECS/GEM, IPC-CFX-2591, IPC-HERMES-9852, and is ideal for Aerospace, Advanced Packaging, Automotive, Data Center, IIOT, Medical, and Mobile Devices. This AXI has a footprint of 1550 x 22400 x 1800 mm.
