Depaneling Equipment

5 Depaneling Equipment from 3 Manufacturers meet your specification.

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Cencorp Automation Oy - 1000 BR EVO2

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Depaneling Equipment from Cencorp Automation Oy

Depaneling Mode: Motorized
PCB Thickness: 5 mm
Max Board Length: 400 mm
Max Board Width: 350 mm
Net Weight: 2100 kg
Overall Dimensions: 2225 x 1000 x 1950 mm

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ASCEN technology - ASC-620

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Depaneling Equipment from ASCEN technology

Depaneling Mode: Manual
PCB Thickness: 0.2 - 4 mm
Max Board Length: 340 mm
Max Board Width: Unlimited
Max Component Height: 40 mm(Top), 24 mm(Bottom)
Net Weight: 252 kg
Overall Dimensions: 700 x 550 x 460 mm

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HEPCO, Inc - 1200-1

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Depaneling Equipment from HEPCO, Inc

Depaneling Mode: Manual
Net Weight: 2.3 kg
Overall Dimensions: 254 x 127 x 203 mm

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Cencorp Automation Oy - 1300 SR

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Depaneling Equipment from Cencorp Automation Oy

Depaneling Mode: Motorized
PCB Thickness: 45 mm spindle: Up to 4 mm (0.16”)
Max Board Length: 610 mm
Max Board Width: 559 mm
Max Component Height: 10 mm
Net Weight: 1000 kg
Overall Dimensions: 1300 x 1440 x 1733 mm

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Cencorp Automation Oy - 1300 BR

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Depaneling Equipment from Cencorp Automation Oy

Depaneling Mode: Motorized
Max Board Length: 500 mm
Max Board Width: 400 mm
Net Weight: 1800 kg
Overall Dimensions: 1300 x 1900 x 1850 mm

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1 - 5 of 5 Depaneling Equipment

Manufacturer Name	Country	Products
AmpliTech	United States	668 Products
AR RF/Microwave Instrumentation	United States	535 Products
Exodus Advanced Communications	United States	791 Products
Holzworth Instrumentation	United States	2 Products
NuWaves Engineering	United States	63 Products

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