Solder Spheres - MacDermid Alpha Electronics Solutions

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MacDermid Alpha Electronics Solutions - ALPHA HRL3

Solder Sphere from MacDermid Alpha Electronics Solutions

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Solder Spheres for BGA, CSP, and Flip Chip Wafer Bumping

Type: Lead Free
Alloy: HRL3
Package Type: Jar
Diameter: 0.23 to 0.8 mm
Tolerance: ± 0.20
Melting Temperature: 138 to 145 Degree C
RoHS: Yes
Net Weight: 1 to 6 oz

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