AGP ELECTRONIC INC.

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  • Type: Manufacturer, Assembly
  • Taiwan
  • 886-3-3581266
  • No.640. Chung-Cheng Road, Tao Yuan City, Taiwan. 330

 PCB Fabrication Capabilities

PCB Board

PCB Configuration

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AGP ELECTRONIC INC.

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Layers

16 Layers

Board Thickness

0.2 - 8.0 mm

Board Dimensions

700 x 590 mm

PCB Type

  • RF
  • High Tg
  • Aluminium
  • Metal-based
  • Copper
  • Halogen-free
  • Ceramic

Material

  • CEM
  • CEM-1
  • CEM-2
  • CEM-3
  • Duroid
  • FR-1
  • FR-2
  • FR-4
  • FR-5
  • Kapton
  • Polyester
  • Polyethylene
  • Polyflon
  • Polyimide
  • PTFE
  • Pyralux
  • Teflon
  • XPC
  • FR-3

Material Brand

  • Arlon
  • Chin-Shi
  • Denka
  • Dupont
  • Isola
  • Iteq
  • Kingboard
  • Laird
  • Matsushita
  • Nanya
  • Nelco
  • Neltec
  • Panasonic
  • Rogers

    Material Brand Series

    • Rogers 4350
    • Rogers 4003
  • Taconic
  • Tuc
  • Ventec
  • Metclad
  • Shengyi
  • Bergquist
  • Grace

PCB Assembly Capabilities

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AGP ELECTRONIC INC.

Board Size

360 x 800 mm

Fine Pitch

8 mils

Parts Procurement

Turnkey

Testing

  • Automated Optical Inspection (AOI)
  • X-Ray Inspection
  • Visual Inspection
  • In-Circuit Testing (ICT)
  • Functional Testing
  • Backplane Testing
  • Burn In Testing
  • Component Inspection
  • Component Value Check
  • DFT (Design for Testability)
  • ERSA Scope
  • Flying Probe Testing
  • Grid Testing
  • High voltage Testing
  • Hi-pot Testing
  • IC Burning
  • Impedance Testing
  • Soak Testing
  • Solder Paste Inspection
  • Thermal Aging Testing

Soldering Type

Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSBGA
  • DSP
  • FFPGA
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • MSOPS
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • TSSOP
  • VFBGA
  • VGA
  • WLCSP
  • XFP

File Format

  • Ascii CAD
  • CAD
  • Centroid
  • DXF
  • Gerber
  • ODB ++
  • Orcad
  • Pulsonix

Order Type

PCB Design Capabilities

Design Services

  • PCB Layout and Design
  • Schematic Entry
  • Panel Design for Manufacturing
  • Other

Design Software

  • PROTEL (Altium)
  • PADS Power PCB
  • ORCAD
  • WG
  • Cadence Allegro
  • Eagle
  • Kicad
  • EasyEda
  • PCBWeb Designer
  • ZenitPCB
  • TinyCAD
  • Osmond PCB
  • ExpressPCB
  • gEDA
  • Fritzing
  • Pad2Pad
  • DesignSpark
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AGP ELECTRONIC INC.

PCB Stencil Capabilities

Stencil Type

  • Framework
  • Non-Framework

Fiducials

  • Half Lasered on Board Side
  • Half Lasered on Squeegee Side
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AGP ELECTRONIC INC.

Stencil Type

PCB Repair / Rework Services

  • Circuitry & Pad Damage Repair
  • BGA Rework
  • Trace repair
  • Component repair
  • Pad & Track Repair
  • Solder Mask Repair
  • BGA Reballing
  • BGA Pad Demage Repair
  • Pad-on-Via Repair
  • Gold Plating Rework
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AGP ELECTRONIC INC.

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