Andwin Circuits

(0 reviews)
  • Type: Manufacturer, Assembly
  • China, Shenzhen, BaoAn
  • +86 755 2832 9394
  • NO.121,CuiGangXi RD, FuYong,BaoAn,Shenzhen, China

Andwin Circuits as a industry leading of PCB manufacturer with in 12 Years. Specializing in Rigid flex, HDI, controlled impedance PCB and Radio Frequency Circuit quick turn prototype to mass products.

PCB Fabrication Capabilities

Layers

Up to 50 Layers

Board Thickness

0.118 - 0.314 Inches

Board Dimensions

210 x 600 mm Max

PCB Configuration

  • Single Sided
  • Double Sided

PCB Board

PCB Type

Material

  • CEM
  • CEM-1
  • CEM-2
  • CEM-3
  • Duroid
  • FR-1
  • FR-2
  • FR-4
  • FR-5
  • Kapton
  • Polyester
  • Polyethylene
  • Polyflon
  • Polyimide
  • PTFE
  • Pyralux
  • Teflon
  • XPC
  • FR-3

Material Brand

  • Arlon
  • Chin-Shi
  • Denka
  • Dupont
  • Isola
  • Iteq
  • Kingboard
  • Laird
  • Matsushita
  • Nanya
  • Nelco
  • Neltec
  • Panasonic
  • Rogers

    Material Brand Series

    • Rogers 4350
    • Rogers 4003
  • Taconic
  • Tuc
  • Ventec
  • Metclad
  • Shengyi
  • Bergquist
  • Grace

Manufacture Type

PCB Assembly Capabilities

Parts Procurement

Turnkey PCB

Board Type

  • Flexible
  • Rigid
  • Hybrid
  • HDI
  • Rigid-Flex

PCB Sides

  • Single Sided

Assembly Type

Testing

  • Automated Optical Inspection (AOI)
  • X-Ray Inspection
  • Visual Inspection
  • In-Circuit Testing (ICT)
  • Functional Testing
  • Backplane Testing
  • Burn In Testing
  • Component Inspection
  • Component Value Check
  • DFT (Design for Testability)
  • ERSA Scope
  • Flying Probe Testing
  • Grid Testing
  • High voltage Testing
  • Hi-pot Testing
  • IC Burning
  • Impedance Testing
  • Soak Testing
  • Solder Paste Inspection
  • Thermal Aging Testing

Soldering Type

  • Hand Soldering
  • Leaded Solder
  • Lead-Free (RoHS)
  • Wave Soldering
  • Reflow Soldering
  • Robotic Soldering
  • Selective Soldering
  • Tin-lead Solder

Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSBGA
  • DSP
  • FFPGA
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • MSOPS
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • TSSOP
  • VFBGA
  • VGA
  • WLCSP
  • XFP

File Format

  • Ascii CAD
  • CAD
  • Centroid
  • DXF
  • Gerber
  • ODB ++
  • Orcad
  • Pulsonix

Order Type

  • Prototypes
  • Production

Capabilites

General
Layer count2-50
Impedance Controlled ToleranceMin.+/-5%, General+/-10%
Lines/spaces3/3m mil (0.075/0.075mm)
Panel size600x800(mm)
Solder mask ColorGreen, Blue, White, Black, Red, etc.
Thickness
Board thickness6.0mm(236mil)
Aspect Ration16:1
Copper thickness
External Cu Thickness0.5 OZ - 40 OZ ( 17um - 1400 um)
Internal Cu Thickness0.5OZ - 6OZ ( 17um - 210um)
Materials
MaterialsFR-4, FR-5, Teflon, High Tg, Halogen Free
Materials BrandsRogers, Arlon, Taconic
Drilling
CNC Machine Drill0.15mm(6 mil)
Laser Drilling0.1mm(4 mil)
Final finishing
Final finishingHASL Lead Free, HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Plat hard Gold Finger
General
Layers1-16
Lines/spaces3/3m mil (0.075/0.075mm)
Solder mask ColorGreen, Blue, White, Black, Red, etc.
Thickness
1-2 Layers Maximum3.0mm(118mil)
Multilayer Maximum8.0mm(315mil)
Aspect Ration10:1
Materials
MaterialsFR-4, High Tg
Materials BrandsDuPont, Arlon
Drilling
Drill Min.0.2mm(8 mil)
CNC Machine Drill6.35mm(250 mil)
Panel size
1-2 Layers Maximum220 X 600mm
Multilayer Maximum210x600mm
Copper thickness
External Flex Cu Thickness1/4 OZ - 1 OZ ( 8.75um - 35um)
External Rigid Cu Thickness1 OZ - 5.5OZ(35un - 193um)
Internal Flex Cu Thickness1/4 OZ - 1 OZ ( 8.75um - 35um)
Internal Rigid Cu Thickness0.5OZ - 1.5OZ ( 17um - 53um)
Final finishing
Final finishingHASL Lead Free, ENIG, OSP, Immersion Silver, Immersion Tin, Plat hard Gold Finger
General
Layers1-6
Lines/spaces3/3m mil (0.075/0.075mm)
Solder mask ColorGreen, Blue, White, Black, Red, etc.
Thickness
1-2 Layers Maximum3.0mm(118mil)
Multilayer Maximum8.0mm(315mil)
Aspect Ration10:1
Materials
MaterialsFR-4, High Tg
Materials BrandsDuPont, Arlon
Panel size
1-2 Layers Maximum220 X 600mm
Multilayer Maximum210x600mm
Copper thickness
External Flex Cu Thickness1/4 OZ - 1 OZ ( 8.75um - 35um)
External Rigid Cu Thickness1 OZ - 5.5OZ(35un - 193um)
Internal Flex Cu Thickness1/4 OZ - 1 OZ ( 8.75um - 35um)
Internal Rigid Cu Thickness0.5OZ - 1.5OZ ( 17um - 53um)
Final finishing
Final finishingHASL Lead Free, ENIG, OSP, Immersion Silver, Immersion Tin, Plat hard Gold Finger

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