EFFEI S.R.L.

(0 reviews)
  • Type: Manufacturer
  • Italy, Tuscany, Firenze
  • 3.91e+011
  • Via Aldo Moro, 11/13 50019 Sesto Fiorentino (FI) - ITALY
In 50 years EFFE.I moved through all steps of PCB, from project to finished product. Workers and employees are skilled people able to provide customer satisfaction. Starting from electrical circuit, we develop both PCB as mechanical parts, we can supply just parts or assembled circuit with our partners.

 PCB Fabrication Capabilities

PCB Board

  • Rigid
  • Flexible
  • Rigid-flex
  • HDI
  • Hybrid PCB
  • Burn-In

PCB Configuration

  • Single Sided
  • Double Sided
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EFFEI S.R.L.

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Layers

Up to 16 Layers

Board Thickness

0.003 - 0.125 Inches

Board Dimensions

460 x 590 mm Max

PCB Type

  • RF
  • High Tg
  • Aluminium
  • Metal-based
  • Copper
  • Halogen-free
  • Ceramic

Material

  • CEM
  • CEM-1
  • CEM-2
  • CEM-3
  • Duroid
  • FR-1
  • FR-2
  • FR-4
  • FR-5
  • Kapton
  • Polyester
  • Polyethylene
  • Polyflon
  • Polyimide
  • PTFE
  • Pyralux
  • Teflon
  • XPC
  • FR-3

Material Brand

  • Arlon
  • Chin-Shi
  • Denka
  • Dupont
  • Isola
  • Iteq
  • Kingboard
  • Laird
  • Matsushita
  • Nanya
  • Nelco
  • Neltec
  • Panasonic
  • Rogers

    Material Brand Series

    • Rogers 4350
    • Rogers 4003
  • Taconic
  • Tuc
  • Ventec
  • Metclad
  • Shengyi
  • Bergquist
  • Grace

PCB Assembly Capabilities

Board Type

  • Flexible
  • Rigid
  • Hybrid
  • HDI
  • Rigid-Flex

Assembly Type

  • Mixed
  • Surface Mount
  • Thru Hole

PCB Sides

  • Single Sided
  • Double Sided
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EFFEI S.R.L.

Testing

  • Automated Optical Inspection (AOI)
  • X-Ray Inspection
  • Visual Inspection
  • In-Circuit Testing (ICT)
  • Functional Testing
  • Backplane Testing
  • Burn In Testing
  • Component Inspection
  • Component Value Check
  • DFT (Design for Testability)
  • ERSA Scope
  • Flying Probe Testing
  • Grid Testing
  • High voltage Testing
  • Hi-pot Testing
  • IC Burning
  • Impedance Testing
  • Soak Testing
  • Solder Paste Inspection
  • Thermal Aging Testing

Soldering Type

  • Hand Soldering
  • Leaded Solder
  • Lead-Free (RoHS)
  • Wave Soldering
  • Reflow Soldering
  • Robotic Soldering
  • Selective Soldering
  • Tin-lead Solder

Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSBGA
  • DSP
  • FFPGA
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • MSOPS
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • TSSOP
  • VFBGA
  • VGA
  • WLCSP
  • XFP

File Format

  • Ascii CAD
  • CAD
  • Centroid
  • DXF
  • Gerber
  • ODB ++
  • Orcad
  • Pulsonix

Order Type

  • Prototypes
  • Production

PCB Design Capabilities

Design Services

  • PCB Layout and Design
  • Schematic Entry
  • Panel Design for Manufacturing
  • Other

Design Software

  • PROTEL (Altium)
  • PADS Power PCB
  • ORCAD
  • WG
  • Cadence Allegro
  • Eagle
  • Kicad
  • EasyEda
  • PCBWeb Designer
  • ZenitPCB
  • TinyCAD
  • Osmond PCB
  • ExpressPCB
  • gEDA
  • Fritzing
  • Pad2Pad
  • DesignSpark
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EFFEI S.R.L.

PCB Stencil Capabilities

Stencil Type

  • Framework
  • Non-Framework

Fiducials

  • Half Lasered on Board Side
  • Half Lasered on Squeegee Side
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EFFEI S.R.L.

Stencil Type

PCB Repair / Rework Services

  • Circuitry & Pad Damage Repair
  • BGA Rework
  • Trace repair
  • Component repair
  • Pad & Track Repair
  • Solder Mask Repair
  • BGA Reballing
  • BGA Pad Demage Repair
  • Pad-on-Via Repair
  • Gold Plating Rework
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EFFEI S.R.L.

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