Flex PCB

(0 reviews)
  • Type: Manufacturer, Design, Assembly
  • United States, California, Santa Ana
  • 1-888-397-9545
  • 1301 E. Hunter Ave Santa Ana, CA 92705, USA

Headquartered in Santa Ana, CA, USA, Flex PCB has been an industry leading rigid-flex and flex PCB manufacturer since 1980. Specializing in flexible circuit rapid quick turn prototyping. This allows our customers to get-to-market faster, affordably, and more efficiently. Partner with us today and accelerate your innovative development projects. We have the capabilities to turnaround flex PCBs with exotic designs using a wide range of different materials.

PCB Fabrication Capabilities

Layers

Up to 18 Layers

Board Dimensions

250 x 400 mm Max

PCB Configuration

  • Single Sided
  • Double Sided

PCB Board

PCB Type

  • RF
  • High Tg
  • Aluminium
  • Metal-based
  • Copper
  • Halogen-free
  • Ceramic

Material

  • CEM
  • CEM-1
  • CEM-2
  • CEM-3
  • Duroid
  • FR-1
  • FR-2
  • FR-4
  • FR-5
  • Kapton
  • Polyester
  • Polyethylene
  • Polyflon
  • Polyimide
  • PTFE
  • Pyralux
  • Teflon
  • XPC
  • FR-3

Material Brand

  • Arlon
  • Chin-Shi
  • Denka
  • Dupont
  • Isola
  • Iteq
  • Kingboard
  • Laird
  • Matsushita
  • Nanya
  • Nelco
  • Neltec
  • Panasonic
  • Rogers

    Material Brand Series

    • Rogers 4350
    • Rogers 4003
  • Taconic
  • Tuc
  • Ventec
  • Metclad
  • Shengyi
  • Bergquist
  • Grace

Manufacture Type

PCB Assembly Capabilities

Board Type

PCB Sides

Testing

  • Automated Optical Inspection (AOI)
  • X-Ray Inspection
  • Visual Inspection
  • In-Circuit Testing (ICT)
  • Functional Testing
  • Backplane Testing
  • Burn In Testing
  • Component Inspection
  • Component Value Check
  • DFT (Design for Testability)
  • ERSA Scope
  • Flying Probe Testing
  • Grid Testing
  • High voltage Testing
  • Hi-pot Testing
  • IC Burning
  • Impedance Testing
  • Soak Testing
  • Solder Paste Inspection
  • Thermal Aging Testing

Soldering Type

  • Hand Soldering
  • Leaded Solder
  • Lead-Free (RoHS)
  • Wave Soldering
  • Reflow Soldering
  • Robotic Soldering
  • Selective Soldering
  • Tin-lead Solder

Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSBGA
  • DSP
  • FFPGA
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • MSOPS
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • TSSOP
  • VFBGA
  • VGA
  • WLCSP
  • XFP

File Format

  • Ascii CAD
  • CAD
  • Centroid
  • DXF
  • Gerber
  • ODB ++
  • Orcad
  • Pulsonix

Capabilites

General
Layer Count10
Panel Size250mm x 400 mm
Line Width and Spacing.003" (0.07mm)
Copper Thickness1/2 oz. and higher
Via/ Drill Size
Drill (Mechanical) Hole Diameter.008" (0.2 mm)
Minimum Via (Laser) Size5 mil (0.15 mm)
Minimum Micro Via (Laser) Size3 mil (0.07 mm)
Stiffener MaterialPolyimide / FR4 / Metal
Shielding MaterialCopper / Silver Ink / Tatsuta / Carbon
Solder Mask
Solder Mask Bridge Between Dam5 mil (0.13 mm)
Solder Mask Registration Tolerance4 mil (0.11 mm)
Coverlay
Coverlay Registration8 mil (0.20 mm)
PIC Registration7 mil (0.18 mm)
General
Layer CountUp to 4
Standard Panel Size100mm x 100mm
Line Width and Spacing.003" (0.07mm)
Copper Thickness1/4 to 1/2 oz.
Via/ Drill Size
Drill (Mechanical) Hole Diameter.006" (0.15 mm)
Minimum Via (Laser) Size1 mil (0.025 mm)
Minimum Micro Via (Laser) Size1 mil (0.025 mm)
Stiffener MaterialPolyimide / FR4 / Metal
Shielding MaterialCopper / Silver Ink / Tatsuta / Carbon
Solder Mask
Solder Mask Bridge Between Dam4 mil (0.11 mm)
Solder Mask Registration Tolerance4 mil (0.11 mm)
Coverlay
Coverlay Registration5 mil (0.13 mm)
PIC Registration4 mil (0.11 mm)
General
Layer CountUp to 18
Standard Panel Size250mm x 400mm
Line Width and Spacing.003" (0.07mm)
Copper Thickness1/2 oz. and higher
Via/ Drill Size
Drill (Mechanical) Hole Diameter.008" (0.2 mm)
Minimum Via (Laser) Size6 mil (0.15 mm)
Minimum Micro Via (Laser) Size3 mil (0.07 mm)
Stiffener MaterialPolyimide / FR4
Shielding MaterialCopper / Silver Ink / Tatsuta / Carbon
Solder Mask
Solder Mask Bridge Between Dam5 mil (0.13 mm)
Solder Mask Registration Tolerance5 mil (0.13 mm)
Coverlay
Coverlay Registration8 mil (0.20 mm)
PIC Registration7 mil (0.18 mm)

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