HDC Technologies

(0 reviews)
  • Type: Manufacturer
  • India, Karnataka, Bangalore
  • 91-80-41229200
  • B-3, Shilpitha Cascade, 6th Cross, Balaji Layout, Kaggadasapura, Bengaluru, Karnataka 560093

HDC Technologies is a leading provider of high complexity, multi-layer Printed Circuit Boards (PCBs) and Electro-Mechanical Solutions (E-MS). Based in Bangalore, India, HDC Technologies supports the full electronic product lifecycle, complete from quick turn PCB to cost effective, high volume fabrication. Our Electro-Mechanical Solutions leverages a vertically integrated model to provide an extensive range of products, including backplane assemblies, cabinets, enclosures, racks, and more.

PCB Fabrication Capabilities Get PCB Fabrication Quote

Layers

Up to 60 Layers

Board Thickness

0.001 - 0.3 Inches

Timeline

1 to 5 Days

Board Dimensions

28 x 49 Inches

PCB Configuration

  • Single Sided
  • Double Sided

PCB Board

PCB Type

  • RF
  • High Tg
  • Aluminium
  • Metal-based
  • Copper
  • Halogen-free
  • Ceramic

Material

  • CEM
  • CEM-1
  • CEM-2
  • CEM-3
  • Duroid
  • FR-1
  • FR-2
  • FR-4
  • FR-5
  • Kapton
  • Polyester
  • Polyethylene
  • Polyflon
  • Polyimide
  • PTFE
  • Pyralux
  • Teflon
  • XPC
  • FR-3

Material Brand

  • Arlon
  • Chin-Shi
  • Denka
  • Dupont
  • Isola
  • Iteq
  • Kingboard
  • Laird
  • Matsushita
  • Nanya
  • Nelco
  • Neltec
  • Panasonic
  • Rogers

    Material Brand Series

    • Rogers 4350
    • Rogers 4003
  • Taconic
  • Tuc
  • Ventec
  • Metclad
  • Shengyi
  • Bergquist
  • Grace

Manufacture Type

PCB Assembly Capabilities Get PCB Assembly Quote

Board Type

  • Flexible
  • Rigid
  • Hybrid
  • HDI
  • Rigid-Flex

PCB Sides

  • Single Sided

Assembly Type

  • Mixed
  • Surface Mount
  • Thru Hole

Testing

  • Automated Optical Inspection (AOI)
  • X-Ray Inspection
  • Visual Inspection
  • In-Circuit Testing (ICT)
  • Functional Testing
  • Backplane Testing
  • Burn In Testing
  • Component Inspection
  • Component Value Check
  • DFT (Design for Testability)
  • ERSA Scope
  • Flying Probe Testing
  • Grid Testing
  • High voltage Testing
  • Hi-pot Testing
  • IC Burning
  • Impedance Testing
  • Soak Testing
  • Solder Paste Inspection
  • Thermal Aging Testing

Soldering Type

  • Hand Soldering
  • Leaded Solder
  • Lead-Free (RoHS)
  • Wave Soldering
  • Reflow Soldering
  • Robotic Soldering
  • Selective Soldering
  • Tin-lead Solder

Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSBGA
  • DSP
  • FFPGA
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • MSOPS
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • TSSOP
  • VFBGA
  • VGA
  • WLCSP
  • XFP

File Format

  • Ascii CAD
  • CAD
  • Centroid
  • DXF
  • Gerber
  • ODB ++
  • Orcad
  • Pulsonix

Order Type

  • Prototypes
  • Production

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