Heros Electronics (Shenzhen) Co., Ltd.

(0 reviews)
  • Type: Manufacturer, Design, Assembly
  • China, Baoan District, ShenZhen City
  • +86-755-2749 5167 Ext. 806
  • 3F, A4 Building, Junfeng Industrial Park, Chongqing Road, Fuyong Street, Bao'an District, Shenzhen, China.

PCB Fabrication Capabilities

Layers

Up to 30 Layers

Board Thickness

0.7 - 3.1 mm

Timeline

7 - 28 Days

PCB Configuration

  • Single Sided
  • Double Sided

PCB Board

PCB Type

Material

  • CEM
  • CEM-1
  • CEM-2
  • CEM-3
  • Duroid
  • FR-1
  • FR-2
  • FR-4
  • FR-5
  • Kapton
  • Polyester
  • Polyethylene
  • Polyflon
  • Polyimide
  • PTFE
  • Pyralux
  • Teflon
  • XPC
  • FR-3

Material Brand

Manufacture Type

PCB Assembly Capabilities

Board Size

550 x 450 mm

Stencils

Solder Paste Stenciling

Fine Pitch

0.5 mm

BGA Pitch

0.2 mm

Board Type

  • Flexible
  • Rigid
  • Hybrid
  • HDI
  • Rigid-Flex

PCB Sides

Testing

Soldering Type

Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSBGA
  • DSP
  • FFPGA
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • MSOPS
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • TSSOP
  • VFBGA
  • VGA
  • WLCSP
  • XFP

File Format

  • Ascii CAD
  • CAD
  • Centroid
  • DXF
  • Gerber
  • ODB ++
  • Orcad
  • Pulsonix

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