PRINTED s.r.o

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  • Type: Manufacturer, Assembly, Design
  • Czech Republic, Ceskolipská, Melník
  • +420 315 670 137
  • Ceskolipská str. 1449 27601 Melník
  • Certifications : ISO 9001:2008

 PCB Fabrication Capabilities

PCB Board

PCB Configuration

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PRINTED s.r.o

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Layers

Up to 26 Layers

Board Thickness

1.5 mm

Timeline

1 - 5 days

Board Dimensions

380 x 500 mm

PCB Type

  • RF
  • High Tg
  • Aluminium
  • Metal-based
  • Copper
  • Halogen-free
  • Ceramic

Material

  • CEM
  • CEM-1
  • CEM-2
  • CEM-3
  • Duroid
  • FR-1
  • FR-2
  • FR-4
  • FR-5
  • Kapton
  • Polyester
  • Polyethylene
  • Polyflon
  • Polyimide
  • PTFE
  • Pyralux
  • Teflon
  • XPC
  • FR-3

Material Brand

  • Arlon
  • Chin-Shi
  • Denka
  • Dupont
  • Isola
  • Iteq
  • Kingboard
  • Laird
  • Matsushita
  • Nanya
  • Nelco
  • Neltec
  • Panasonic
  • Rogers

    Material Brand Series

    • Rogers 4350
    • Rogers 4003
  • Taconic
  • Tuc
  • Ventec
  • Metclad
  • Shengyi
  • Bergquist
  • Grace

PCB Assembly Capabilities

Board Type

  • Flexible
  • Rigid
  • Hybrid
  • HDI
  • Rigid-Flex

Assembly Type

  • Mixed
  • Surface Mount
  • Thru Hole
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PRINTED s.r.o

Time Line General

1 - 28 Days

Stencils

Laser Cut Stainless Steel Stencil

Coating

Conformal Coating

Testing

  • Automated Optical Inspection (AOI)
  • X-Ray Inspection
  • Visual Inspection
  • In-Circuit Testing (ICT)
  • Functional Testing
  • Backplane Testing
  • Burn In Testing
  • Component Inspection
  • Component Value Check
  • DFT (Design for Testability)
  • ERSA Scope
  • Flying Probe Testing
  • Grid Testing
  • High voltage Testing
  • Hi-pot Testing
  • IC Burning
  • Impedance Testing
  • Soak Testing
  • Solder Paste Inspection
  • Thermal Aging Testing

Soldering Type

Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSBGA
  • DSP
  • FFPGA
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • MSOPS
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • TSSOP
  • VFBGA
  • VGA
  • WLCSP
  • XFP

File Format

  • Ascii CAD
  • CAD
  • Centroid
  • DXF
  • Gerber
  • ODB ++
  • Orcad
  • Pulsonix

PCB Design Capabilities

Design Services

Design Software

  • PROTEL (Altium)
  • PADS Power PCB
  • ORCAD
  • WG
  • Cadence Allegro
  • Eagle
  • Kicad
  • EasyEda
  • PCBWeb Designer
  • ZenitPCB
  • TinyCAD
  • Osmond PCB
  • ExpressPCB
  • gEDA
  • Fritzing
  • Pad2Pad
  • DesignSpark

The development center of the company Printed s.r.o offers the complete customized electronics design including the layout, hardware and firmware design as well as an optimization and upgrade of your current products. All our services are concentrated in-house, which results in a significant reduction of the development costs and time-to-market reduction. Therefore your competitive ability increases.

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PRINTED s.r.o

PCB Stencil Capabilities

Stencil Type

  • Framework
  • Non-Framework

Fiducials

  • Half Lasered on Board Side
  • Half Lasered on Squeegee Side
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PRINTED s.r.o

Stencil Type

PCB Repair / Rework Services

  • Circuitry & Pad Damage Repair
  • BGA Rework
  • Trace repair
  • Component repair
  • Pad & Track Repair
  • Solder Mask Repair
  • BGA Reballing
  • BGA Pad Demage Repair
  • Pad-on-Via Repair
  • Gold Plating Rework
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PRINTED s.r.o

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