AIM to Showcase its Ultrafine No Clean Solder Paste at SMTA Austin Expo

AIM to Showcase its Ultrafine No Clean Solder Paste at SMTA Austin Expo712370

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, has announced its participation in the upcoming SMTA Austin Expo & Tech Forum taking place on February 6 at the Travis County Exposition Center in Austin, Texas. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die-attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

SMTA Austin Expo & Tech Forum provides a great platform to bring professionals within the industry together and provide attendees with exposure to global technology at a local level. In addition, this local expo provides an opportunity to educate local engineers who may not be able to attend SMTA International.

Click here to learn more about SMTA Austin Expo & Tech Forum.

Click here to learn more about NC259FPA from AIM Solder.

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