RPS Automation Receives Order for Pulsar Solderability System from Cobham Advanced Electronic Solutions

RPS Automation Receives Order for Pulsar Solderability System from Cobham Advanced Electronic Solutions712370

Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, has announced that it has received an order from Cobham Advanced Electronic Solutions for a Pulsar solderability system. The Pulsar utilizes the highly proven dip-and-look test method which is a qualitative type test performed by comparative analysis after specimens are dipped in a bath of flux and molten solder.  

The Hentec/RPS Pulsar Solderability Test System is offered in single or dual pot configurations. The Pulsar uses a “dip and look” method and can be configured for low-volume lead tinning production. Designed for lab environments, the table-top system provides high precision PLC motion control, easy touch screen programming, and PID temperature management for complete process control. Hentec’s rapid custom tool holder fabrication can solve any odd-form or exotic component handling challenges.

An advantage of the dip-and-look method is since it is based on the comparative analysis it can be performed rapidly by shop floor personnel with minimal training as well as requires significantly lower capital investment than a wetting balance test system. The Pulsar solderability test system complies with all applicable solderability test standards including MIL-STD-883 Method 2003, IPC J-STD-002, and MIL-STD-202 Method 208.

Click here to learn more about Hentec's Pulsar Solderability Test systems.

Publisher: PCB Directory
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