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DuPont, a leader in advanced material solutions and technologies, participated in the DesignCon 2025 Expo, which took place January 29 - 30 in Santa Clara, California. This premier conference attracts System, Board, and Chip manufacturing professionals seeking innovative materials and technologies. DuPont showcased its extensive portfolio of electronics solutions featuring Pyralux® flex circuit laminates and adhesive systems and Kapton® polyimide films at booth #502.
DuPont’s trailblazing films and flex circuit materials are specifically engineered to enhance signal integrity and thermal performance for critical applications like AI printed circuit boards, 5G networks, EVs, and consumer electronics. The Pyralux® portfolio features flexible copper-clad laminates, overlays, and adhesives with low dissipation factors specifically designed for high-speed applications. These products excel under high service temperatures and maintain their integrity in extreme conditions when paired with resilient Kapton® films.
DuPont also introduced the latest generation of Pyralux® flex circuit cover lays, which provide enhanced dimensional stability, low-ion migration, and high-speed, high-frequency properties essential for cutting-edge devices.
Attendees who visited DuPont’s booth could see a variety of displays including a model of the Mars Perseverance Rover and a cell phone teardown station. They also experienced live product demonstrations and consultations with their experts to discover how DuPont can be a trusted partner in advancing innovation and driving technology forward.
Click here to view comprehensive coverage of DesignCon 2025 on PCB Directory.
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