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IPC, the association connecting electronics industries, will be offering a day-long technical education seminar, Design for Excellence (DFX): DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly). The seminar will be held in conjunction with PCB Carolina event on November 12 in Raleigh NC at the McKimmon Conference and Training Center.
Providing a comprehensive review of pitfalls that can occur in assembly and how they often have a direct link to design, the seminar will be led by instructor Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation.
Geared toward designers, manufacturing/process engineers, quality and reliability engineers, and managers or technicians involved in the design, fabrication, assembly or testing of printed board assemblies, attendees will learn:
According to Brook Sandy-Smith, IPC Technical Conference Program Manager, there is a direct connection between the design of a device and complications that may occur in the assembly process. This course will shine a light on those opportunities for improvement, taught by a distinguished expert in the field.
Click here for more information on Design for Excellence (DFX): DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly) or to Register for the Seminar.
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