MKS’ Atotech and ESI to Present PCB and Advanced Packaging Solutions at JPCA 2026

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MKS Inc., a provider of enabling technologies, announced that its brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will present their latest developments in advanced packaging, package substrate, and printed circuit board (PCB) manufacturing at the JPCA Show in Tokyo, Japan, from June 10–12. Visitors can meet MKS representatives at booth C2-32 and learn more about the company’s solutions for advanced electronics manufacturing.

As one of Asia’s exhibitions for PCB and electronic packaging technologies, the JPCA Show brings together domestic and international industry players as the expansion of AI infrastructure, high-performance computing (HPC), and next-generation interconnect architectures drives demand for increasingly precise manufacturing solutions.

At its booth, MKS will present a portfolio spanning precision chemistry, plating systems, laser drilling platforms, optics, motion control, IIoT software, and training services. This integrated offering reflects the company’s Optimize the InterconnectSM approach and is designed to help customers improve efficiency and process performance across manufacturing operations.

The approach brings together expertise in lasers, optics, motion, chemistry, and plating systems to help address the challenges of modern electronics production. MKS states that integrating ESI’s laser drilling platforms with Atotech’s chemistry and plating technologies supports higher precision, interconnect performance, and continued miniaturization for next-generation devices.

Supported by local technical expertise, MKS’ Atotech helps customers improve process yields, streamline manufacturing, and optimize total cost of ownership.

A range of process and equipment solutions will be featured, including:

Chemical Process Highlights

• Printoganth® MV TP3 series: Electroless copper for advanced packaging applications
• Cupraganth® MV: Copper-based activation system for advanced packaging applications
• NovaBond® EX-S2: Differential etching solution designed for advanced package substrates, enabling material removal in SAP manufacturing
• EcoFlash® S 300 U: Differential etching for SAP manufacturing
• InPro® SAP7: VCP pattern BMV filling with within-unit distribution at high CDs
• InPro® Pulse TGV: Copper filling for high-aspect-ratio through-glass vias
• Stanna®-Flex: Tin finish for flexible substrates offering plating properties, material compatibility, and fine-line performance

Equipment Solutions

• G-Plate®: Vertical desmear and electroless HVM plating tool for package substrates with particle control
• vPlate®: Vertical conveyor plating equipment for HDI PCB and package substrates
• CapstoneTM: Flex PCB UV drilling tool for productivity in flexible PCB manufacturing
• 5335™ Flex PCB Laser Drill: High-volume FPC laser drilling machine for flexible PCB manufacturing
• Geode™ Platform Solutions: PCB and advanced substrate CO2 and UV laser via drills

Event Details

The company will exhibit at JPCA 2026, taking place from June 10–12, 2026, at Tokyo Big Sight (East Hall 2) in Tokyo, Japan. Visitors can meet MKS representatives at Booth C2-32 to learn more about the company’s PCB and advanced packaging manufacturing solutions.

Click here to learn more about the MKS.

Event

JPCA Show 2026