Latest PCB (Printed Circuit Board) News | soldering

Indium Corporation, a developer and manufacturer of materials for semiconductor packaging, electronics assembly, thermal management, and advanced industrial applications, will showcase its portfolio of materials for semiconductor packaging and assembly at the IEEE Electronic Components and Technolog... Read More

OKI has launched Comprehensive Electronics Manufacturing Services (EMS) for AI server equipment. These comprehensive services will cover all processes, from the design and production of large-size multi-layer printed circuit boards (PCBs) incorporating OKI's proprietary high heat dissipation tec... Read More

PVA, a supplier of automated dispensing and coating equipment, will exhibit at productronica India, taking place April 8–10, 2026, in Greater Noida, India. Attendees can visit Hall 15, Booth H15.H11 to view the company’s solutions for electronics manufacturing.At the show, PVA will featu... Read More

Kurtz Ersa Inc., a supplier of electronics production equipment, in collaboration with its Canadian representative Comtree Inc., will participate in EPTECH Toronto 2026 on April 21 and EPTECH Montreal 2026 on April 23. At both events, Comtree will present the VERSAFLOW 4 CORE Edition selective solde... Read More

Solderstar, a provider of thermal profiling systems and process optimisation solutions for electronics manufacturing, has appointed Scanditron as its distribution partner across the Nordic and Baltic regions. Scanditron has experience supporting electronics manufacturers and supplies equipment, mate... Read More

KOKI Europe, a manufacturer of soldering materials, is highlighting the capabilities of its S3X58-HF1200 lead-free solder paste, an SMT material engineered to support electronics manufacturing processes. S3X58-HF1200 is a halogen-free flux type according to J-STD-004C (<0.05%) and has been develo... Read More

Schweizer, a Germany-based company specializing in advanced printed circuit board (PCB) and embedding solutions, has developed bond PCB (bare die) technology as part of its HDI portfolio, enabling direct chip placement and electrical connection through wire bonding. The approach is designed to suppo... Read More

MacDermid Alpha Electronics Solutions, a supplier of specialty chemicals and materials used in electronics manufacturing and semiconductor packaging, will present its integrated materials platform at Productronica China 2026, taking place March 25–27 at the Shanghai New International Expo Cent... Read More

KOKI Solder America, developer and supplier of soldering materials and related process solutions for electronics manufacturing, announced that it will exhibit at IPC APEX EXPO 2026, taking place March 17–19 at the Anaheim Convention Center in Anaheim, California. Attendees can visit KOKI at Bo... Read More

VPF GmbH & Co. KG from Sprockhövel has developed a new polyimide adhesive material (VPF item 630900-1001-801): A technically high-performance polyimide system that combines excellent thermal and chemical resistance with very good printability. It is available from 200 m², with impressi... Read More

K&F Electronics, a third-generation, family-owned electronics assembly provider, has installed a SASinno Ultra-i1 offline selective soldering system, expanding its selective soldering capacity and improving process consistency for customer programs that require precise, repeatable results.Founde... Read More

Indium Corporation®, a provider of advanced materials solutions for power device packaging, announced that it will showcase its high-reliability product portfolio at CIPS – International Conference on Integrated Power Electronics Systems, taking place March 10 - 12 in Dresden, Germany.Amon... Read More

ITW EAE has announced the launch of the Vitronics Soltec ProcessGuard option, an advanced monitoring and analytics solution developed to enhance reliability, consistency, and quality in electronics assembly operations. Designed for modern manufacturing environments, ProcessGuard provides real-time v... Read More

Rush PCB Inc. is a trusted PCB manufacturing partner known for delivering reliable, high-quality circuit boards for diverse industries. Among its advanced surface finishing options, Rush PCB offers ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) plating, a versatile and high-perform... Read More

Heraeus Electronics will exhibit at the 2026 APEX EXPO at the Anaheim Convention Center, Booth 1730, where the company will showcase a broad portfolio of assembly materials focused on power module and advanced electronics applications.APEX EXPO 2026: Click here to register for this event.At this yea... Read More

PCBCart offers advanced via-in-pad manufacturing capabilities designed to support fine-pitch components, compact layouts, and performance-critical applications. As electronic products continue to shrink in size while growing in complexity, via-in-pad (VIP) technology is used to achieve higher routin... Read More

Piher Sensing Systems continues to expand the possibilities of integrated electronics with its advanced printed PCB resistor technology. Leveraging market-leading thick-film processes, Piher enables the direct deposition of fixed resistors, potentiometer tracks, switches, and conductors onto PCBs of... Read More

Kurtz Ersa Inc., a leading supplier of electronics production equipment, will exhibit at the 2026 IPC APEX EXPO, taking place March 17 to 19 at the Anaheim Convention Center in Anaheim, California. Visitors to Booth 2113 will be able to see the latest additions to Ersa’s portfolio of reflow, s... Read More

Sierra Circuits brings extensive experience in designing and manufacturing PCBs with castellated holes, supporting customers who require robust, space-efficient module integration. As electronic products continue to move toward compact, modular designs, castellated holes, also known as plated half-h... Read More

YINCAE, a leader in advanced electronic materials, has introduced a new solderable adhesive, the EN 256ED. EN 256ED is a next-generation material that combines soldering and encapsulation into a single process, delivering enhanced solder joint strength while eliminating the need for secondary encaps... Read More