Cadence Unveils 3D Electromagnetic Field Solver with 10x Faster Performance & Unbounded Capacity

Description


If you’re a smartphone user then you are part of an ever more connected and digital world. At Amdocs, we are leading the digital revolution into the future. From virtualized telecommunications networks, Big Data and Internet of Things to mobile financial services, billing and operational support systems, we are continually evolving our business to help you become more connected. We make sure that when you watch a video on YouTube, message friends on SnapChat or send your images on Instagram, you get a great service anytime, anywhere, and on any device. We are at the heart of the telecommunications industry working with giants such as AT&T, Vodafone, Telstra and Telefonica, helping them create an amazing new world for you where technology is being used in amazing new ways every single day.


General
Number of Layers 1 - 12
Board Materials FR4, FR406, IS410, Kapton, Shin-Etsu - Epoxy, Rogers - Epoxy, Dupont FR - FR Acrylic, Dupont LF - LF Acrylic, Adhesiveless Base Materials
Maximum Board Size 16
Copper Thickness 0.5 oz - 3 oz
Hole Aspect Ratio 7:1
Minimum Hole Size 0.008
Minimum Trace/Space 0.006
Minimum Drill-to-Copper 0.010
Minimum Pitch 1 mm
Final Finish HASL (Solder), Lead Free Solder, Copper, Gold, Gold Fingers, White Tin, OSP
Solder Mask Green, Black, Red, Blue, Yellow, White, Clear
Coverlay FR Coverlay, LF Coverlay, Shin-Etsu, Flexible Soldermask
Silk Screen White, Black, Yellow
PCB Fabrication Scoring, Route & Retain
Additional Features Plated Slots, Non-plated Slots, Controlled Dielectric, Covered Vias, Counter Sinks, Counter Bores, Dual Access Flex, Suspended Leads
Quality Standards IPC 6012 Class 2, Electrical Testing, 100% Netlist Testing, TDR Testing
Minimum Board Thickness
2 layer 0.010
4 layer 0.020
6 layer 0.020
8 layer 0.062
10 layer 0.062
12 layer 0.062
Maximum Board Thickness
2 layer 0.125
3-12 layer 0.200
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