Automating Inter-Layer In-Design Checks in Rigid-Flex PCBs

Automating Inter-Layer In-Design Checks in Rigid-Flex PCBs

Inside a variety of small electronic devices—from earphones to smartphones, tablets, and laptops—are rigid-flex PCBs comprised of rigid and flexible substrates laminated together. Such circuits are considered reliable, versatile, and space efficient. As designs continue to shrink for a variety of applications, this type of flexible substrate for electronic circuitry keeps growing in popularity, particularly in consumer electronics (Figure 1). Because of the bending possible with rigid-flex circuits, designers can place much more circuitry into the space available, even stacking the board layers in a 3D format on the rigid side. Multiple stack-up zones contribute to lower cost.

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