Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications

  •  Institute of Electrical and Electronics Engineers (IEEE)
Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications

Glass substrates are emerging as a key alternative to silicon and conventional organic substrates for high-density and high-performance systems due to their outstanding dimensional stability, enabling sub-5-µm lithographic design rules, excellent electrical performance, and unique mechanical properties, key in achieving board-level reliability at body sizes larger than 15 × 15 mm2.

This paper describes the first demonstration of the board-level reliability of such large, ultrathin glass ball grid array (BGA) packages directly mounted onto a system board, considering both their thermal cycling and drop-test performances....

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