Coated Copper Foils for High Density Interconnects

Coated Copper Foils for High Density Interconnects

The automotive, computer and telecom industries have embraced microvia technology as a key driver for growth in high density interconnect packaging, PCMCIA cards and reduced layer count designs. Also, rigid-flex applications and chip scale packaging alternatives are utilizing coated copper technology. Several large circuit board fabricators currently produce large volumes of boards built with microvia and buried via material enablers. Table 1 highlights the PCB design advantages of these materials and the following text explains advantages of the two largest current applications, redistribution layers and PC cards.

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