If you allow the temperature of your board to fluctuate excessively, or rise to extremes, you can drastically reduce the lifespan of your design. This eBook will take a look at thermodynamic principles to keep in mind when designing your next printed circuit board.
This chapter provides a quick review of thermodynamic terms. The second chapter discusses thermal failure mechanisms and basic design considerations. The third chapter discusses heat sources and heat sinks in board design. The fourth and final chapter will discuss heat mitigation tips and techniques.
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