Wave Soldering Equipment

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Madell Technology Corporation - MD-350PC

Wave Soldering Equipment from Madell Technology Corporation

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Solder Pot Capacity: 400 kg
Preheat Zones: 4 Zones
PCB Size: 350 mm
Flux Volume: 5.2 L
General Power: 23 kW
Power Supply: 3 phase, 5 lines, 380V (or 220V)
Net Weight: 1350 kg
Overall Dimensions: 4.3 x 1.36 x 1.68 m

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Beijing Chengliankaida Technology Co, Ltd - BS200

Wave Soldering Equipment from Beijing Chengliankaida Technology Co, Ltd

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Solder Pot Capacity: 220 kg
Wave Width: 800mm
PCB Size: 30--250 mm
PCB Direction: Left to Right
Flux Volume: 3.5 LITRES
Power Supply: 3P AC220V 0.18KW×2PCS
Net Weight: 700Kg
Overall Dimensions: 2500×1200×1650mm

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Shenzhen HTGD Intelligent Equipment Co., Ltd - GDK-450

Wave Soldering Equipment from Shenzhen HTGD Intelligent Equipment Co., Ltd

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Solder Pot Capacity: 400 kg
Solder Temperature: 300 Degree C
Preheat Zones: 4 Zones
PCB Size: 50 to 450 mm
PCB Direction: Left to Right
Flux Volume: 6 litres
General Power: 28 kW
Power Supply: 3P AC 380V 50 Hz
Air Supply: 5 to 7 kgf/cm³
Net Weight: 1800 kg
Overall Dimensions: 3600 x 1460 x 1700 mm

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Madell Technology Corporation - MD-300DS

Wave Soldering Equipment from Madell Technology Corporation

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Solder Pot Capacity: 350 kg
Preheat Zones: 1 Zone
PCB Size: 300 mm
Flux Volume: 5.2 L
General Power: 25 kW
Power Supply: 3 phase, 5 lines, 380V
Net Weight: 1000 kg
Overall Dimensions: 2.6 x 1.2 x 1.6 m

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Beijing Chengliankaida Technology Co, Ltd - BS120

Wave Soldering Equipment from Beijing Chengliankaida Technology Co, Ltd

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Solder Pot Capacity: 120 kg
Wave Width: 700mm
PCB Size: 50--250 mm
PCB Direction: Left to Right
Flux Volume: 6LITRES
Power Supply: 3P AC380V 50HZ
Net Weight: 550Kg
Overall Dimensions: 2100×1200×1650mm

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Shenzhen HTGD Intelligent Equipment Co., Ltd - HS05-2000Plus

Wave Soldering Equipment from Shenzhen HTGD Intelligent Equipment Co., Ltd

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Solder Pot Capacity: 7 kg
Solder Temperature: 350 Degree C
PCB Size: 300 x 300 mm
Flux Volume: 1 Litre
General Power: 10 kW
Power Supply: 220 V 50/60 Hz
Net Weight: 650 kg
Overall Dimensions: 1600 x 1500 x 1362 mm

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Madell Technology Corporation - MD-250DS

Wave Soldering Equipment from Madell Technology Corporation

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Solder Pot Capacity: 180 kg
Preheat Zones: 1 Zone
PCB Size: 250 mm
Flux Volume: 5.2 L
General Power: 13 kW
Power Supply: 3 phase, 5 lines, 380V
Net Weight: 600 kg
Overall Dimensions: 2.3 x 1.0 x 1.8 m

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Beijing Chengliankaida Technology Co, Ltd - BS300

Wave Soldering Equipment from Beijing Chengliankaida Technology Co, Ltd

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Wave: Dual Wave
Solder Pot Capacity: 320 kg
Wave Width: 1600mm
PCB Size: 30--350 mm
PCB Direction: Left to Right
Flux Volume: 6LITRES
Power Supply: 3P AC220V 0.36KW×2PCS
Net Weight: 1200kg
Overall Dimensions: 3900×1400×1650mm

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Shenzhen HTGD Intelligent Equipment Co., Ltd - GDK-350

Wave Soldering Equipment from Shenzhen HTGD Intelligent Equipment Co., Ltd

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Solder Pot Capacity: 400 kg
Solder Temperature: 300 Degree C
Preheat Zones: 4 Zones
PCB Size: 50 to 350 mm
PCB Direction: Left to Right, Right to Left
Flux Volume: 6 Litres
General Power: 28 kW
Power Supply: 3P AC 380 V 50 Hz
Net Weight: 1800 kg
Overall Dimensions: 3600 x 1360 x 1700 mm

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Madell Technology Corporation - MD-150DS

Wave Soldering Equipment from Madell Technology Corporation

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Solder Pot Capacity: 60 kg
Preheat Zones: 1 Zone
PCB Size: 250 mm
Flux Volume: 3 L
General Power: 8 kW
Power Supply: Single phase, 220V
Net Weight: 85 kg
Overall Dimensions: 1.3 x 1.0 x 1.6 m

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Wave Soldering Equipment

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Madell Technology Corporation - MD-350PC

Beijing Chengliankaida Technology Co, Ltd - BS200

Shenzhen HTGD Intelligent Equipment Co., Ltd - GDK-450

Madell Technology Corporation - MD-300DS

Beijing Chengliankaida Technology Co, Ltd - BS120

Shenzhen HTGD Intelligent Equipment Co., Ltd - HS05-2000Plus

Madell Technology Corporation - MD-250DS

Beijing Chengliankaida Technology Co, Ltd - BS300

Shenzhen HTGD Intelligent Equipment Co., Ltd - GDK-350

Madell Technology Corporation - MD-150DS

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