Wave Soldering Equipment

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Flason Electronic Co.,ltd - FLASON N250

Wave Soldering Equipment from Flason Electronic Co.,ltd

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Solder Pot Capacity: 220 kg
Preheat Zones: 2 Zones
PCB Size: 50-250mm
General Power: 11KW
Power Supply: 380V 6KW
Net Weight: 700KG
Overall Dimensions: 1800(L)*1200(W)*1600(H)

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e-Flex SMT Microsystems, Co. Ltd - EFLEX-450-M

Wave Soldering Equipment from e-Flex SMT Microsystems, Co. Ltd

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Solder Pot Capacity: 550 kg
Preheat Zones: 3 Zones
PCB Size: 50 to 450 mm
General Power: 37 kW
Power Supply: 3P 5W 380V AC
Overall Dimensions: 3645 x 1582 x 1735 mm

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Shenzhen HTGD Intelligent Equipment Co., Ltd - GDK-450

Wave Soldering Equipment from Shenzhen HTGD Intelligent Equipment Co., Ltd

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Solder Pot Capacity: 400 kg
Solder Temperature: 300 Degree C
Preheat Zones: 4 Zones
PCB Size: 50 to 450 mm
PCB Direction: Left to Right
Flux Volume: 6 litres
General Power: 28 kW
Power Supply: 3P AC 380V 50 Hz
Air Supply: 5 to 7 kgf/cm³
Net Weight: 1800 kg
Overall Dimensions: 3600 x 1460 x 1700 mm

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SEHO Systems GmbH - SEHO Power Wave

Wave Soldering Equipment from SEHO Systems GmbH

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Wave Width: 100 to 400 mm
Preheat Zones: 4 Zones
General Power: 21 kw/31 kw
Air Supply: 6 bar
Overall Dimensions: 2980 x 1300 mm,4140 x 1300 mm

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TAMURA Corporation - TNW40-36EF

Wave Soldering Equipment from TAMURA Corporation

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Solder Pot Capacity: 370 kg
PCB Size: 120 x 50, 450 x 400 mm
Power Supply: AC 200 V±10% - 50/60 Hz
Net Weight: 1850 kg
Overall Dimensions: 3600 x 1470 x 1860 mm

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Manncorp - 16.350 Ultra Compact

Wave Soldering Equipment from Manncorp

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Wave: Dual Wave
Solder Pot Capacity: 250 kg
Solder Temperature: Room Temperature - 300 Degree C
Wave Width: 360 mm
PCB Size: 350 mm
General Power: 18 kW
Power Supply: 3Φ220V, 50A, 60 Hz
Air Supply: 4 kfg/cm2
Net Weight: 360 kg
Overall Dimensions: 2550 x 1150 x 1650 mm

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Flason Electronic Co.,ltd - FLASON N300

Wave Soldering Equipment from Flason Electronic Co.,ltd

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Solder Pot Capacity: 280 kg
Preheat Zones: 3 Zones
PCB Size: 50-300mm
General Power: 19KW
Net Weight: 1000KG
Overall Dimensions: 2800(L)*1250(W)*1560(H)

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e-Flex SMT Microsystems, Co. Ltd - EFLEX-350-H

Wave Soldering Equipment from e-Flex SMT Microsystems, Co. Ltd

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Solder Pot Capacity: 480 kg
Preheat Zones: 4 Zones
PCB Size: 50 to 350 mm
General Power: 43 kW
Power Supply: 3P 5W 380V AC
Overall Dimensions: 4145 x 1582 x 1735 mm

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Shenzhen HTGD Intelligent Equipment Co., Ltd - HS05-2000Plus

Wave Soldering Equipment from Shenzhen HTGD Intelligent Equipment Co., Ltd

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Solder Pot Capacity: 7 kg
Solder Temperature: 350 Degree C
PCB Size: 300 x 300 mm
Flux Volume: 1 Litre
General Power: 10 kW
Power Supply: 220 V 50/60 Hz
Net Weight: 650 kg
Overall Dimensions: 1600 x 1500 x 1362 mm

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SEHO Systems GmbH - SEHO Go Wave

Wave Soldering Equipment from SEHO Systems GmbH

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Wave Width: 340 mm
Preheat Zones: 4 Zones
PCB Size: 410 x 340 mm
General Power: 3 kw
Power Supply: 8 kw
Air Supply: 250 l/min
Net Weight: 185 kg / 150 kg

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Wave Soldering Equipment

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Flason Electronic Co.,ltd - FLASON N250

e-Flex SMT Microsystems, Co. Ltd - EFLEX-450-M

Shenzhen HTGD Intelligent Equipment Co., Ltd - GDK-450

SEHO Systems GmbH - SEHO Power Wave

TAMURA Corporation - TNW40-36EF

Manncorp - 16.350 Ultra Compact

Flason Electronic Co.,ltd - FLASON N300

e-Flex SMT Microsystems, Co. Ltd - EFLEX-350-H

Shenzhen HTGD Intelligent Equipment Co., Ltd - HS05-2000Plus

SEHO Systems GmbH - SEHO Go Wave

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