Wave Soldering Equipment

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Flason Electronic Co.,ltd - FLASON N250

Wave Soldering Equipment from Flason Electronic Co.,ltd

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Solder Pot Capacity: 220 kg
Preheat Zones: 2 Zones
PCB Size: 50-250mm
General Power: 11KW
Power Supply: 380V 6KW
Net Weight: 700KG
Overall Dimensions: 1800(L)*1200(W)*1600(H)

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Shenzhen Leadsmt Technology Co.,Ltd - WS-GOT-300DS

Wave Soldering Equipment from Shenzhen Leadsmt Technology Co.,Ltd

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Solder Temperature: 350 Degree C
Preheat Zones: 3 zones
Flux Volume: 0 - 100 ml
Power Supply: AC 380 V 50/60 Hz
Net Weight: 900 Kg
Overall Dimensions: 3650 x 1200 x 1650 mm

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Oubel Group - SE-250T

Wave Soldering Equipment from Oubel Group

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350 °C Wave Soldering Equipment for Lead-Free/Lead Tin Soldering

Wave: Dual Wave
Solder Pot Capacity: 180 kg
Solder Temperature: Room Temperature - 350 '+/-1 Degree C
Preheat Zones: 2 Zones
PCB Size: 0 - 250 mm
PCB Direction: Left to Right, Right to Left
Flux Volume: 10 - 100 ml/min
General Power: 11 kW
Power Supply: 3P 5W (5W, 3P) 380V
Air Supply: 3 kg/cm2
Net Weight: 300 kg
Overall Dimensions: 2600 x 1200 x 1600 mm

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Shenzhen HTGD Intelligent Equipment Co., Ltd - GDK-450

Wave Soldering Equipment from Shenzhen HTGD Intelligent Equipment Co., Ltd

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Solder Pot Capacity: 400 kg
Solder Temperature: 300 Degree C
Preheat Zones: 4 Zones
PCB Size: 50 to 450 mm
PCB Direction: Left to Right
Flux Volume: 6 litres
General Power: 28 kW
Power Supply: 3P AC 380V 50 Hz
Air Supply: 5 to 7 kgf/cm³
Net Weight: 1800 kg
Overall Dimensions: 3600 x 1460 x 1700 mm

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Flason Electronic Co.,ltd - FLASON N300

Wave Soldering Equipment from Flason Electronic Co.,ltd

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Solder Pot Capacity: 280 kg
Preheat Zones: 3 Zones
PCB Size: 50-300mm
General Power: 19KW
Net Weight: 1000KG
Overall Dimensions: 2800(L)*1250(W)*1560(H)

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Oubel Group - SE-450-PLUS

Wave Soldering Equipment from Oubel Group

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Wave: Dual Wave
Solder Pot Capacity: 550 kg
Preheat Zones: 3 zones
PCB Size: 50 - 450 mm
PCB Direction: Left to Right, Right to Left
General Power: 37 kW
Power Supply: AC 380V, 50/60 Hz
Net Weight: 2000 kg
Overall Dimensions: 4445 x 1582 x 1735 mm

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Shenzhen HTGD Intelligent Equipment Co., Ltd - HS05-2000Plus

Wave Soldering Equipment from Shenzhen HTGD Intelligent Equipment Co., Ltd

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Solder Pot Capacity: 7 kg
Solder Temperature: 350 Degree C
PCB Size: 300 x 300 mm
Flux Volume: 1 Litre
General Power: 10 kW
Power Supply: 220 V 50/60 Hz
Net Weight: 650 kg
Overall Dimensions: 1600 x 1500 x 1362 mm

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Flason Electronic Co.,ltd - Flason N450

Wave Soldering Equipment from Flason Electronic Co.,ltd

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Solder Pot Capacity: 420 kg
Preheat Zones: 4 Zones
PCB Size: 60-350mm
General Power: 30KW
Power Supply: 3P5W,380/220V 50Hz 63A
Net Weight: 1500KG
Overall Dimensions: 4300(L)*1400(W)*1560(H)

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Oubel Group - SMART-450-E

Wave Soldering Equipment from Oubel Group

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Wave: Dual Wave
Solder Pot Capacity: 430 kg
Solder Temperature: Room Temperature - 350 '+/-1 Degree C
Preheat Zones: 4 Zones
PCB Size: 0 - 450 mm
PCB Direction: Left to Right, Right to Left
Flux Volume: 10 - 100 ml/min
General Power: 26 kW
Power Supply: 3P 5W (5W, 3P) 380V
Air Supply: 4 - 7 kg/cm2
Net Weight: 2500 kg
Overall Dimensions: 4600 x 1500 x 1750 mm

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Shenzhen HTGD Intelligent Equipment Co., Ltd - GDK-350

Wave Soldering Equipment from Shenzhen HTGD Intelligent Equipment Co., Ltd

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Solder Pot Capacity: 400 kg
Solder Temperature: 300 Degree C
Preheat Zones: 4 Zones
PCB Size: 50 to 350 mm
PCB Direction: Left to Right, Right to Left
Flux Volume: 6 Litres
General Power: 28 kW
Power Supply: 3P AC 380 V 50 Hz
Net Weight: 1800 kg
Overall Dimensions: 3600 x 1360 x 1700 mm

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Wave Soldering Equipment

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Flason Electronic Co.,ltd - FLASON N250

Shenzhen Leadsmt Technology Co.,Ltd - WS-GOT-300DS

Oubel Group - SE-250T

Shenzhen HTGD Intelligent Equipment Co., Ltd - GDK-450

Flason Electronic Co.,ltd - FLASON N300

Oubel Group - SE-450-PLUS

Shenzhen HTGD Intelligent Equipment Co., Ltd - HS05-2000Plus

Flason Electronic Co.,ltd - Flason N450

Oubel Group - SMART-450-E

Shenzhen HTGD Intelligent Equipment Co., Ltd - GDK-350

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