Wave Soldering Equipment

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Flason Electronic Co.,ltd - FLASON N250

Wave Soldering Equipment from Flason Electronic Co.,ltd

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Solder Pot Capacity: 220 kg
Preheat Zones: 2 Zones
PCB Size: 50-250mm
General Power: 11KW
Power Supply: 380V 6KW
Net Weight: 700KG
Overall Dimensions: 1800(L)*1200(W)*1600(H)

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e-Flex SMT Microsystems, Co. Ltd - EFLEX-450-M

Wave Soldering Equipment from e-Flex SMT Microsystems, Co. Ltd

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Solder Pot Capacity: 550 kg
Preheat Zones: 3 Zones
PCB Size: 50 to 450 mm
General Power: 37 kW
Power Supply: 3P 5W 380V AC
Overall Dimensions: 3645 x 1582 x 1735 mm

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Shenzhen HTGD Intelligent Equipment Co., Ltd - GDK-450

Wave Soldering Equipment from Shenzhen HTGD Intelligent Equipment Co., Ltd

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Solder Pot Capacity: 400 kg
Solder Temperature: 300 Degree C
Preheat Zones: 4 Zones
PCB Size: 50 to 450 mm
PCB Direction: Left to Right
Flux Volume: 6 litres
General Power: 28 kW
Power Supply: 3P AC 380V 50 Hz
Air Supply: 5 to 7 kgf/cm³
Net Weight: 1800 kg
Overall Dimensions: 3600 x 1460 x 1700 mm

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SUN EAST Tech Development Co., Ltd - ETS-300E

Wave Soldering Equipment from SUN EAST Tech Development Co., Ltd

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Solder Pot Capacity: 350 kg
Solder Temperature: 300 Degree C
Preheat Zones: 2 Zones
PCB Size: 50 - 300 mm
PCB Direction: Left to Right, Right to Left
General Power: 27 kW
Power Supply: 3PH, 380V, 50 Hz
Net Weight: 1450 kg
Overall Dimensions: 3385 x 1190 x 1540 mm

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Neoden - ND55T

Wave Soldering Equipment from Neoden

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Solder Pot Capacity: 16 kg
Solder Temperature: 400 Degree C
PCB Size: 550 x 500 mm
Flux Volume: 2 litres
General Power: 1.5 kW
Net Weight: 350 kg
Overall Dimensions: 1600 x 1150 x 1602 mm

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Shenzhen JT Automation Equipment Co., Ltd. - SMART-450-H

Wave Soldering Equipment from Shenzhen JT Automation Equipment Co., Ltd.

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Solder Pot Capacity: 550 kg
Solder Temperature: 300 Degree C
Preheat Zones: 4 Zones
PCB Size: 50 to 450 mm
General Power: 43 kW
Power Supply: AC 380 V 50/60 Hz
Overall Dimensions: 4445 x 1582 x 1735 mm

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Flason Electronic Co.,ltd - FLASON N300

Wave Soldering Equipment from Flason Electronic Co.,ltd

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Solder Pot Capacity: 280 kg
Preheat Zones: 3 Zones
PCB Size: 50-300mm
General Power: 19KW
Net Weight: 1000KG
Overall Dimensions: 2800(L)*1250(W)*1560(H)

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e-Flex SMT Microsystems, Co. Ltd - EFLEX-350-H

Wave Soldering Equipment from e-Flex SMT Microsystems, Co. Ltd

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Solder Pot Capacity: 480 kg
Preheat Zones: 4 Zones
PCB Size: 50 to 350 mm
General Power: 43 kW
Power Supply: 3P 5W 380V AC
Overall Dimensions: 4145 x 1582 x 1735 mm

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Shenzhen HTGD Intelligent Equipment Co., Ltd - HS05-2000Plus

Wave Soldering Equipment from Shenzhen HTGD Intelligent Equipment Co., Ltd

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Solder Pot Capacity: 7 kg
Solder Temperature: 350 Degree C
PCB Size: 300 x 300 mm
Flux Volume: 1 Litre
General Power: 10 kW
Power Supply: 220 V 50/60 Hz
Net Weight: 650 kg
Overall Dimensions: 1600 x 1500 x 1362 mm

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SUN EAST Tech Development Co., Ltd - SST-350

Wave Soldering Equipment from SUN EAST Tech Development Co., Ltd

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Lead-Free Wave Soldering Equipment with 3 Preheat Zones

Solder Pot Capacity: 480 kg
Solder Temperature: 300 Degree C
Preheat Zones: 3 zones
PCB Size: 50 - 350 mm
PCB Direction: Left to Right, Right to Left
General Power: 33 kW
Power Supply: 3PH, 380V, 50 Hz
Net Weight: 1600 kg
Overall Dimensions: 4420 x 1422 x 1750 mm

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Wave Soldering Equipment

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Flason Electronic Co.,ltd - FLASON N250

e-Flex SMT Microsystems, Co. Ltd - EFLEX-450-M

Shenzhen HTGD Intelligent Equipment Co., Ltd - GDK-450

SUN EAST Tech Development Co., Ltd - ETS-300E

Neoden - ND55T

Shenzhen JT Automation Equipment Co., Ltd. - SMART-450-H

Flason Electronic Co.,ltd - FLASON N300

e-Flex SMT Microsystems, Co. Ltd - EFLEX-350-H

Shenzhen HTGD Intelligent Equipment Co., Ltd - HS05-2000Plus

SUN EAST Tech Development Co., Ltd - SST-350

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