What is No-Clean Flux?

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Editorial Team - PCB Directory

May 8, 2023

Soldering in a PCB (Printed Circuit Board) refers to the process of joining electronic components to the board using solder, which is a metal alloy that melts at a low temperature and solidifies as it cools down. Soldering is a crucial step in PCB assembly, as it forms a reliable electrical and mechanical connection between the component and the board. However, PCB surfaces may have impurities on them (corrosion, oxidation, etc.) which prevents the solder from creating a bond with the metal surface of the PCB. This results in solder deformities. To solve the problem of improper soldering, a Flux is used.

What is a Flux?

In soldering, flux is a chemical compound used to clean, protect, and facilitate the flow of solder by removing or preventing oxidation and other impurities from the metal surfaces to be soldered. Flux is typically applied to the metal surfaces before soldering to ensure a strong and reliable bond between the solder and the metal. Flux is necessary because metals can develop oxide layers on their surfaces, which can interfere with the soldering process and weaken the resulting joint. Flux helps to remove these oxides by reacting with them and breaking them down, allowing the solder to bond more effectively with the metal.

Flux can come in different forms, including liquid, paste, or solid, and can be either water-soluble or non-water-soluble. It is important to use the appropriate type of flux for the specific soldering application, as using the wrong type of flux or applying too much flux can result in contamination, poor adhesion, or other problems with the solder joint.

Regular Soldering Flux/Paste

In summary, flux is a crucial component in the soldering process, as it helps to ensure clean, strong, and reliable solder joints by removing impurities and preventing oxidation on the metal surfaces.

What is a No-Clean Flux?

A no-clean flux is a type of flux used in soldering that is formulated to leave minimal to no residue after the soldering process is complete. This type of flux is designed to eliminate the need for post-solder cleaning, which can save time and reduce the risk of damaging sensitive electronic components.

No-clean fluxes are formulated with highly activated synthetic resins, organic acids, and other additives that are engineered to break down oxides and other surface contaminants on the metal surfaces being soldered. These fluxes are typically water-soluble and are designed to evaporate quickly, leaving behind little or no residue.

Types: No-clean fluxes are available in different forms, including liquid, paste, or solid, and can be either water-soluble or non-water-soluble. Some no-clean fluxes are formulated for specific applications, such as high-temperature or lead-free soldering.

Advantage: One advantage of using a no-clean flux is that it eliminates the need for additional cleaning steps after the soldering process, which can save time and reduce the risk of damage to sensitive electronic components. Additionally, no-clean fluxes can reduce the environmental impact of soldering by reducing the use of cleaning chemicals and other consumables.

Application: No-clean fluxes are typically applied to the metal surfaces before soldering, using a brush, syringe, or automated dispenser. The flux is then activated by the heat of the soldering process and helps to ensure a strong and reliable bond between the solder and the metal.

However, it is important to note that not all no-clean fluxes are created equal, and some may leave behind residues that can affect the performance or reliability of the solder joint. It is crucial to select the appropriate type of no-clean flux for the specific application and to follow the manufacturer's instructions carefully to ensure a strong and reliable solder joint.

Conclusion

No-clean flux is a type of flux used in soldering that is formulated to leave minimal to no residue after the soldering process is complete. It is designed to eliminate the need for post-solder cleaning, saving time and reducing the risk of damaging sensitive electronic components. No-clean fluxes are formulated with highly activated synthetic resins, organic acids, and other additives that are engineered to break down oxides and other surface contaminants on the metal surfaces being soldered. It is important to select the appropriate type of no-clean flux for the specific application and to follow the manufacturer's instructions carefully to ensure a strong and reliable solder joint. The use of no-clean flux can be beneficial for reducing the environmental impact of soldering by reducing the use of cleaning chemicals and other consumables.

Click here to view Solder Flux listed on PCB Directory from various manufacturers.

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