Solder Paste

767 Solder Paste from 42 manufacturers listed on PCB-Directory

Solder paste is a mixture of powdered solder and flux used in the assembly of PCBs to temporarily hold components in place before soldering. It facilitates the formation of reliable electrical connections during the reflow soldering process. The paste is typically applied using a stencil to ensure precise placement on the PCB pads. Solder Paste from the leading manufacturers is listed on PCB Directory. Narrow down on the solder paste you need based on the type, alloy composition and various other parameters. Download spec sheets and request quotes on the solder paste that you need.

What is Solder Paste? 

Solder paste is a blend of powdered solder alloy and flux. It is used in PCB assembly to secure components to the PCB and ensure proper electrical connection. Solder paste is applied to the PCB through a stencil to ensure it is precisely placed on the solder pads. Once the solder paste is applied and the components are placed, the assembly is subjected to a reflow oven. In the reflow process, the paste is heated until the solder particles melt, creating a strong bond between the component leads and the PCB pads. The flux within the paste also plays a crucial role, as it helps remove oxidation from the metal surfaces, promoting better solder flow and adhesion.

The composition and quality of the solder paste are essential for achieving reliable solder joints. Factors such as the size of the solder particles, the type of flux, and the paste's viscosity must be carefully controlled to ensure optimal performance. Solder pastes are divided into various types as per the IPC J-STD 005 standard based on the particle sizes of the metal alloys: 

Type designation 

Particle size in μm
  (80% min. between)
 

Type 1  

150-75  

Type 2  

75–45  

Type 3  

45–25  

Type 4  

38–20  

Type 5  

25–10  

Type 6  

15–5  

Type 7  

11–2  

Type 8  

8–2  


Key parameters of solder paste 

  • Type: This specifies the type of solder paste according to IPC J-STD 005 standard C. 
  • Alloy Composition: This refers to the combination of metals and their ratio by weight in the solder. 
  • Flux Type: The type of solder flux used to make the solder paste. 
  • Melting Point: Defines the temperature range in degrees over which the solder bar transitions from solid to liquid. 

PCB Directory has listed PCB Solder paste from the leading manufacturers in the industry and made it easy for users to find these pastes based on their requirements. You can specify the type of paste, alloy composition, and other parameters to find a Solder paste that meets your requirements. You can view solder paste specifications, download the spec sheet, and get a quote. Quotes requested are routed to the manufacturers.

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