Solder Spheres

245 Solder Spheres from 6 manufacturers listed on PCB-Directory

A list of PCB Solder Spheres from leading manufacturers is listed in PCB Directory. Narrow down on solder spheres based on your requirements. Download spec sheets, view product details and request quotes on relevant products.

What are Solder Spheres? 

Solder spheres are balls of solder that are used to connect a chip package to a printed circuit board (PCB). Solder spheres can be placed manually or using automated equipment and are held in place with a tacky flux. They are often used in compact package designs like Chip Scale Packages (CSPs), Ball Grid Arrays (BGAs), and Low-Profile BGAs (LBGAs), where traditional bonding wires are impractical due to space constraints. Positioned beneath the package, solder spheres facilitate the miniaturization of integrated circuits by providing a reliable connection method. Available in various diameters from 0.075 to 0.9 mm and are constructed from diverse alloys that can melt at various temperatures, allowing for tailored thermal performance.

Traditional solder spheres possess a range of temperatures over which they transition from solid to liquid, with a semi-solid, gel-like state that aids the bonding process. Alternatively, eutectic solder spheres have a single, precise melting point, making them ideal for high-precision applications that require strict temperature control during assembly. Solder spheres can be made from a wide range of alloys and are available in accurate diameters. They are manufactured in clean facilities to ensure low oxide levels and no organic contamination. 

Key Specification of Solder Balls 

  • Type: Indicates whether the solder is leaded or lead-free, reflecting compliance with environmental regulations and health standards. 
  • Alloy Composition: Details the various metals and their ratios in the alloy used to make the solder spheres which influences their melting temperature, strength, and electrical performance. 
  • Diameter: Defines the size of individual solder spheres, which determines compatibility with various package designs and affects the precision of connections.
  • Package Type: Describes the container or packaging form of the solder spheres, often impacting ease of handling and storage. 
  • Net Weight: States the total weight of the solder spheres in the package, providing insight into the quantity available for use. 

PCB Directory has listed PCB Solder spheres from leading manufacturers in the industry and made it easy for users to find these spheres based on their requirements. You can specify the type, alloy composition, and other parameters to find Solder spheres that meet your requirements. You can also view solder sphere specifications, download the spec sheet, and get a quote. Quotes requested are routed to the manufacturers.

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