SIPLACE CA

The SIPLACE CA from ASMPT GmbH & Co. KG is a Pick and Place Machine that can place bare dies directly from wafers using the die attach or flip chip processes and combine it with the standard SMT placement process. It has a throughput of 46000 cph (flip chip), 30000 cph (die attach), and 126500 cph (SMD). This machine supports die sizes of 0.5-15.0 mm (flip chip), 0.8-15.0 mm (die attach) & 0.11-15.0 mm (SMD), and a die thickness of more than 50 μm (silicon). It supports various packages like RF-MCM, FCIP, FC-MLF, FC-CSP, etc. 

The SIPLACE CA supports wafer sizes from 4 to 12 inches and has a 12/8-inch (6 and 4-inch optional) wafer stretcher to stretch wafers from 2 to 8 mm. It supports flexible dual, single-lane, wafer-lane lane & panel-lane conveyors. This equipment supports substrates like FR4, ceramics, flex, boats, 8/12-inch wafers, etc. of sizes ranging from 50 x 50 mm to 685 x 650 mm (conveyor type dependent) and thickness from 0.3 to 4.5 mm. It can handle hoop rings and supports wafer maps. This horizontal wafer system has multi-die capability and supports automatic wafer exchange. 

The SIPLACE CA has a footprint of 3778 x 2100 x 1835 mm and requires a three-phase AC supply of 400 V.