The MS-11em from MIRTEC is a Solder Paste Inspection Equipment. It utilizes a 25 MP camera system that produces images with a resolution of 7.7 or 10 µm and a height resolution of ±1 μm. This equipment camera uses dual-projection shadow-free Moiré Phase Step image processing technology to produce images for a wide-phase inspection. It can accommodate PCBs weighing up to 4 Kgs and measuring from 50 x 50 mm to 280 x 330 mm. The minimum edge clearance of the camera is 3 mm, and the bottom clearance is 50 mm. It uses a single-stage high-speed conveyor system with programmable width control and automatic PCB support. This equipment implements automated Z-height calibration and PCB under board support systems for operation, with precision PCB warpage compensation ensuring accurate measurements.
The MS-11em utilizes an Intel® Multi-Core PC with a 32” flat screen LCD monitor, Windows 10 OS and other accessories. It uses INTELLISYS Industry 4.0 intelligent factory automation system to facilitate connectivity and optimization, making it an essential tool for quality control in manufacturing processes. This solder paste inspection equipment is available in an enclosure that measures 900 x 1290 x 1660 mm.