AuLTRA 3.2

AuLTRA 3.2

Solder Paste by Indium Corporation (31 more products)

Note: Your request will be directed to Indium Corporation

The AuLTRA™ 3.2 from Indium Corporation is an AuSn Water-Soluble Solder Paste. It is an air or nitrogen reflow solder paste that is formulated to accommodate the higher processing temperatures required by the Au-based alloy. This solder paste provides consistent printing and reflow requirements along with superb wetting and low-voiding. It is available in 80Au20Sn, 79Au21Sn, 78Au22Sn, 77Au23Sn alloy options and have powder sizes from 2 to 7 SGS with metal loadings from 88.5 to 94.0%  according to the intended application method and particle size. The AuLTRA™ 3.2 is available in jars or syringes and has a shelf life of more than 4 months when stores at temperature lower than 5°C.

The AuLTRA™ 3.2 is formulated for automated high-speed, high-reliability, or  single- or multi-point dispensing equipment and high-power LED module array assembly applications. It also functions well in hand-held applications.

Product Specifications

Product Details

  • Part Number
    AuLTRA 3.2
  • Manufacturer
    Indium Corporation
  • Description
    AuSn Water-Soluble Solder Paste for High-Power LED Module Arrays

General Parameters

  • Flux Type
    Water Soluble
  • Alloy
    AuSn
  • Alloy Composition
    80Au20Sn, 79Au21Sn, 78Au22Sn, 77Au23Sn
  • Metal Content
    88.5–94.0%
  • Particle Size
    T2 to T7
  • Melting Point
    40 to 50 Degree C
  • Package Type
    Syringe, Cartridge
  • Shelf Life
    4 Months
  • Storage Temperature
    5 Degree C

Technical Documents

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