The AuLTRA™ 3.2 from Indium Corporation is an AuSn Water-Soluble Solder Paste. It is an air or nitrogen reflow solder paste that is formulated to accommodate the higher processing temperatures required by the Au-based alloy. This solder paste provides consistent printing and reflow requirements along with superb wetting and low-voiding. It is available in 80Au20Sn, 79Au21Sn, 78Au22Sn, 77Au23Sn alloy options and have powder sizes from 2 to 7 SGS with metal loadings from 88.5 to 94.0% according to the intended application method and particle size. The AuLTRA™ 3.2 is available in jars or syringes and has a shelf life of more than 4 months when stores at temperature lower than 5°C.
The AuLTRA™ 3.2 is formulated for automated high-speed, high-reliability, or single- or multi-point dispensing equipment and high-power LED module array assembly applications. It also functions well in hand-held applications.